Sensor shift structures in optical image stabilization suspensions

Patent metadata

Field	Value
Publication number	US-12147059-B2
Application number	US-202017137278-A
Country	US
Kind code	B2
Filing date	Dec 29, 2020
Priority date	Dec 16, 2016
Publication date	Nov 19, 2024
Grant date	Nov 19, 2024

Abstract

A suspension assembly is described. The suspension assembly including a rigid interposer circuit; a plurality of flexible circuits configured to attach to the rigid interposer circuit and movable about an x-axis and a y-axis with respect to the static plate; and a sensor mounting region on the rigid interposer circuit.

First claim

What is claimed is:

1. A suspension assembly comprising:
a rigid interposer circuit;
a sensor mounting region on the rigid interposer circuit; and
one or more flexible circuits including a first flexible circuit portion and a second flexible circuit portion configured to electrically couple the rigid interposer circuit to a printed circuit board, wherein each of the first flexible circuit portion and second flexible circuit portion are each disposed around a corner of the rigid interposer circuit and include one or more angled bends including a first angled bend comprising a first portion configured to connect to the rigid interposer circuit and a second portion angled substantially perpendicular relative to a first plane to the first portion and configured to connect to the printed circuit board that provide a reduced stiffness to enable movement of the rigid interposer circuit with respect to the printed circuit board, and a second angled bend bending the second portion such that a first part of the second portion is angled substantially perpendicular to a second part of the second portion relative to a second plane, the first plane being perpendicular to the second plane, and wherein second angled bends of each of first flexible circuit portion and second flexible circuit portion are bent around different corners of the rigid interposer circuit such that each of the first part and second part of the second portions are in parallel with edges of the rigid interposer circuit, wherein the second portion of each of the one or more flexible circuits extends outward from the first angled bend and includes an attachment feature to reduce a stress on the suspension assembly from motion in a z-axis direction and a bonded tail region adjacent to the attachment feature and comprising a series of bonds for electrically connecting to the printed circuit board.

2. The suspension assembly of claim 1 including an image sensor mounted to the rigid interposer circuit at the sensor mounting region.

3. The suspension assembly of claim 2 , wherein the image sensor is attached to the rigid interposer circuit using a gold ball wire bond.

4. The suspension assembly of claim 1 , wherein the sensor mounting region is electrically coupled with one or more flexible circuits through one or more circuits disposed on the rigid interposer circuit.

5. The suspension assembly of claim 4 , wherein the one or more flexible circuits are configured to mount components on the at least one of the one or more flexible circuits.

6. The suspension assembly of claim 1 , wherein at least one of the flexible circuits receives signal traces.

7. The suspension assembly of claim 6 , wherein at least one of the flexible circuits that does not receive signal traces receives power signals.

8. The suspension assembly of claim 1 , wherein the rigid interposer circuit is configured to receive at least one power component.

9. The suspension assembly of claim 1 comprising an inner housing an outer housing.

10. A sensor shift circuit module comprising:
a rigid interposer circuit;
one or more flexible circuits including a first flexible circuit portion and a second flexible circuit portion configured to attach to the rigid interposer circuit, wherein each of the first flexible circuit portion and second flexible circuit portion are each disposed around a corner of the rigid interposer circuit and include one or more angled bends including a first angled bend comprising a first portion configured to connect to the rigid interposer circuit and a second portion angled substantially perpendicular relative to a first plane to the first portion that provide a reduced stiffness to be movable about an x-axis and a y-axis with respect to the rigid interposer circuit, a second angled bend bending the second portion such that a first part of the second portion is angled substantially perpendicular to a second part of the second portion relative to a second plane, the first plane being perpendicular to the second plane, and wherein second angled bends of each of first flexible circuit portion and second flexible circuit portion are bent around different corners of the rigid interposer circuit such that each of the first part and second part of the second portions are in parallel with edges of the rigid interposer circuit, wherein the second portion of each of the one or more flexible circuits extends outward from the first angled bend and includes an attachment feature to reduce a stress on the suspension assembly from motion in a z-axis direction and a bonded tail region adjacent to the attachment feature and comprising a series of bonds for electrically connecting to the printed circuit board; and
a sensor mounting region on the rigid interposer circuit.

11. The sensor shift circuit module of claim 10 including an image sensor mounted to the rigid interposer circuit at the sensor mounting region.

12. The sensor shift circuit module of claim 11 , wherein the image sensor is attached to the rigid interposer circuit using a wire bonding technique.

13. The sensor shift circuit module of claim 11 , wherein the sensor mounting region is within a z-height space defined by the rigid interposer circuit.

14. The sensor shift circuit module of claim 10 including a lens and optionally an auto focus mechanism generally fixedly mounted about the x-y axes with respect to the rigid interposer circuit.

15. The sensor shift circuit module of claim 10 , wherein at least one of the flexible circuits receives signal traces.

16. The sensor shift circuit module of claim 15 , wherein at least one of the flexible circuits that does not receive signal traces receives power signals.

17. The sensor shift circuit module of claim 10 , wherein the rigid interposer circuit is configured to receive at least one power component.

18. The sensor shift circuit module of claim 10 comprising an inner housing an outer housing.

Assignees

• Hutchinson Technology

Inventors

• Miller Mark A
• Ladwig Peter F
• Riemer Douglas P
• Jelkin Duane M
• Schumann John L
• Pokornowski Zachary A

Classifications

• H04N23/687

  by shifting the lens or sensor position · CPC title

• G03B2205/0076

  using shape memory alloys · CPC title

• G03B2205/0015

  by displacing one or more optical elements normal to the optical axis · CPC title

• G03B5/00 Primary

  Adjustment of optical system relative to image or object surface other than for focusing · CPC title

• H04N23/682 Primary

  Vibration or motion blur correction · CPC title