Miniature pressure/force sensor with integrated leads

US12216013B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12216013-B2
Application numberUS-202318388473-A
CountryUS
Kind codeB2
Filing dateNov 9, 2023
Priority dateFeb 3, 2016
Publication dateFeb 4, 2025
Grant dateFeb 4, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

First claim

Opening claim text (preview).

The invention claimed is: 1. A capacitive pressure sensor, comprising: a first trace assembly, including: a spring metal diaphragm including a base portion and a moving portion; an insulating layer including a diaphragm portion on the moving portion of the diaphragm and a lead portion extending from the diaphragm; and a conductor layer on the insulating layer including an electrode on the diaphragm portion and a trace extending from the electrode on the lead portion; and a second trace assembly joined to the first trace assembly, including: a diaphragm including a base; an insulating layer having a diaphragm portion on the diaphragm and a lead portion extending from the diaphragm; and a conductor layer on the insulating layer including an electrode on the diaphragm portion and a trace extending from the electrode on the lead portion. 2. The pressure sensor of claim 1 wherein the base portion of the first trace assembly is joined to the base portion of the second trace assembly. 3. The pressure sensor of claim 1 and further including a spacer, and wherein the base portions of the first and second trace assemblies are joined to the spacer. 4. The pressure sensor of claim 1 wherein the spring metal diaphragm includes a plurality of arms coupling the moving portion to the base portion. 5. A capacitive pressure sensor, comprising: a trace assembly, including: a spring metal diaphragm including a base portion and a moving portion; an insulating layer having a diaphragm portion on the moving portion of the diaphragm and a lead portion extending from the diaphragm; a conductor layer on the insulating layer including an electrode on the diaphragm portion and a trace extending from the electrode on the lead portion; and a metal can electrically and mechanically connected to the base portion of the spring metal diaphragm and defining a void adjacent the moving portion of the spring metal diaphragm. 6. A capacitive pressure sensor, comprising: an insulating layer including a diaphragm portion, a lead portion, and first and second opposite sides; a conductor layer on the first side of the insulating layer including: an electrode on the diaphragm portion; a first trace extending from the electrode on the lead portion; and a second trace on the lead portion; a metal spacer member on the second side of the insulating layer around the electrode; a conductive via electrically connecting the second trace to the metal spacer member; and a metal electrode member mechanically and electrically joined to the metal spacer member.

Assignees

Inventors

Classifications

  • for measuring force distributions, e.g. using force arrays (G01L1/148 takes precedence) · CPC title

  • G01L1/2268Primary

    Arrangements for correcting or for compensating unwanted effects · CPC title

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Frequently asked questions

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What does patent US12216013B2 cover?
A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The c…
Who is the assignee on this patent?
Hutchinson Technology
What technology area does this patent fall under?
Primary CPC classification G01L1/2268. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 04 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).