Semiconductor devices having interconnection structures therein with enhanced metal alloys
US-2026005146-A1 · Jan 1, 2026 · US
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Park Gyu-Hee patents
Park Gyu-Hee is listed as an inventor on 38 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Park Gyu-Hee |
| Total patents | 38 |
| First publication | Aug 13, 2015 |
| Latest publication | Jan 1, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Composition for depositing a molybdenum-containing thin film, method for manufacturing a molybdenum-containing thin film, and molybdenum-containing thin film manufactured thereby
US-2025179627-A1 · Jun 5, 2025 · US
Precursor for forming metal thin film, manufacturing method using the same, and metal thin film manufactured thereby
US-2025154648-A1 · May 15, 2025 · US
Thin-film forming composition including aluminum compound, method of forming thin film by using the thin-film forming composition, and method of manufacturing semiconductor device
US-2025157809-A1 · May 15, 2025 · US
Method of manufacturing semiconductor device
US-12051586-B2 · Jul 30, 2024 · US
Atomic layer etching method and semiconductor device manufacturing method using the same
US-11901191-B2 · Feb 13, 2024 · US
Compositions for manufacturing thin film and methods for manufacturing semiconductor device using the same
US-2023220213-A1 · Jul 13, 2023 · US
Metal compounds and methods of fabricating semiconductor devices using the same
US-11524973-B2 · Dec 13, 2022 · US
Atomic layer etching method and semiconductor device manufacturing method using the same
US-2022375760-A1 · Nov 24, 2022 · US
Aluminum compound and method for manufacturing semiconductor device using the same
US-11332486-B2 · May 17, 2022 · US
Recent patents
Latest publications not already listed above.
Materials for fabricating thin films, methods of fabricating thin films using the same, and equipment for fabricating thin films using the same
US-2021380622-A1 · Dec 9, 2021 · US
Method of manufacturing semiconductor device
US-11081389-B2 · Aug 3, 2021 · US
Method of manufacturing semiconductor device
US-2021175073-A1 · Jun 10, 2021 · US
Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compound
US-10913754-B2 · Feb 9, 2021 · US
Method of fabricating semiconductor device
US-10847362-B2 · Nov 24, 2020 · US
Metal compounds and methods of fabricating semiconductor devices using the same
US-2020361970-A1 · Nov 19, 2020 · US
Method of manufacturing semiconductor device
US-2020273747-A1 · Aug 27, 2020 · US
Method of forming a thin film
US-10752645-B2 · Aug 25, 2020 · US
Aluminum compound and method for manufacturing semiconductor device using the same
US-2020207790-A1 · Jul 2, 2020 · US
Method of forming thin film and method of manufacturing integrated circuit device using the same
US-10600643-B2 · Mar 24, 2020 · US
Method of fabricating semiconductor device
US-2019304770-A1 · Oct 3, 2019 · US
Method of forming a thin film
US-2019292207-A1 · Sep 26, 2019 · US
Lanthanum compound, method of synthesizing lanthanum compound, lanthanum precursor composition, method of forming thin film, and method of manufacturing integrated circuit device
US-10329312-B2 · Jun 25, 2019 · US
Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compound
US-2019152996-A1 · May 23, 2019 · US
Methods of forming thin film and fabricating integrated circuit device using niobium compound
US-10259836-B2 · Apr 16, 2019 · US
Aluminum compound and methods of forming thin film and fabricating integrated circuit device by using the same
US-10242877-B2 · Mar 26, 2019 · US
Aluminum compound, method of forming thin film by using the same, and method of fabricating integrated circuit device
US-10224200-B2 · Mar 5, 2019 · US
Method of forming thin film and method of manufacturing integrated circuit device using the same
US-2018342391-A1 · Nov 29, 2018 · US
Method for manufacturing a capacitor for semiconductor devices
US-9923047-B2 · Mar 20, 2018 · US
Aluminum compound, method of forming thin film by using the same, and method of fabricating integrated circuit device
US-2018076024-A1 · Mar 15, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 38 |
| Adeka Corp | 15 |
| Dnf Co Ltd | 6 |
| Air Liquide | 2 |
| Adeka Korea Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C16/45553 | 26 |
| H10P14/668 | 16 |
| H10P14/43 | 16 |
| H10P14/6339 | 13 |
| H10B12/033 | 11 |