Communication protocol using free-space connectivity
US-2026076265-A1 · Mar 12, 2026 · US
This page is not indexed by search engines while we improve data quality.
Morein Stephen patents
Morein Stephen is listed as an inventor on 77 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Morein Stephen |
| Total patents | 77 |
| First publication | Mar 12, 2015 |
| Latest publication | Mar 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Conformal power delivery structures near high-speed signal traces
US-12550768-B2 · Feb 10, 2026 · US
Induction-based inter-chip communication
US-2026040969-A1 · Feb 5, 2026 · US
Microelectronic assemblies including stacked dies coupled by a through dielectric via
US-12525563-B2 · Jan 13, 2026 · US
Monolithic series circuit connections with high-voltage input
US-2026005523-A1 · Jan 1, 2026 · US
Double coil inductive scheme and modulation for z-axis memory links
US-2026005164-A1 · Jan 1, 2026 · US
High throughput additive manufacturing for integrated circuit components containing traces with feature size and grain boundaries
US-12438087-B2 · Oct 7, 2025 · US
Technologies for high throughput additive manufacturing for integrated circuit components
US-12431430-B2 · Sep 30, 2025 · US
3d die stack redistribution layer for topside power delivery to backside die metallization in multichip composite devices
US-2025293137-A1 · Sep 18, 2025 · US
Microelectronic assemblies having topside power delivery structures
US-12374625-B2 · Jul 29, 2025 · US
Recent patents
Latest publications not already listed above.
Microelectronic assemblies having topside power delivery structures
US-2025157941-A1 · May 15, 2025 · US
Microelectronic assemblies having topside power delivery structures
US-2025132259-A1 · Apr 24, 2025 · US
Microelectronic assemblies having topside power delivery structures
US-12243828-B2 · Mar 4, 2025 · US
Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures
US-12242290-B2 · Mar 4, 2025 · US
Package architectures having vertically stacked dies with solder interconnects
US-2025062278-A1 · Feb 20, 2025 · US
Embedded metal lines
US-2025038152-A1 · Jan 30, 2025 · US
Microelectronic assemblies having topside power delivery structures
US-12211796-B2 · Jan 28, 2025 · US
Modular microchannel thermal solutions for integrated circuit devices
US-12199012-B2 · Jan 14, 2025 · US
Embedded metal lines
US-12170268-B2 · Dec 17, 2024 · US
High-throughput additively manufactured power delivery vias and traces
US-12170244-B2 · Dec 17, 2024 · US
Over and under interconnects
US-2024347443-A1 · Oct 17, 2024 · US
Embedded metal lines
US-2024266326-A1 · Aug 8, 2024 · US
Diffused bitline replacement in memory
US-11978724-B2 · May 7, 2024 · US
Microelectronic assemblies including stacked dies coupled by a through dielectric via
US-2024006381-A1 · Jan 4, 2024 · US
Microelectronic assemblies including stacked dies coupled by a through dielectric via
US-2024006366-A1 · Jan 4, 2024 · US
Package architecture with vertical stacking of integrated circuit dies having planarized edges
US-2023420409-A1 · Dec 28, 2023 · US
Package architecture of three-dimensional interconnect cube with integrated circuit dies having planarized edges
US-2023420411-A1 · Dec 28, 2023 · US
Over and under interconnects
US-11830804-B2 · Nov 28, 2023 · US
Metal pcb for topside power delivery
US-2023317706-A1 · Oct 5, 2023 · US
Multi-thread graphics processing system
US-2023289916-A1 · Sep 14, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 35 |
| Ati Technologies Ulc | 15 |
| Adeia Semiconductor Tech Llc | 8 |
| Synaptics Inc | 8 |
| Advanced Micro Devices Inc | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 40 |
| H10W90/701 | 25 |
| H10W90/297 | 23 |
| H10W70/611 | 23 |
| H01L25/50 | 20 |