Modular microchannel thermal solutions for integrated circuit devices

Patent metadata

Field	Value
Publication number	US-12199012-B2
Application number	US-202016914066-A
Country	US
Kind code	B2
Filing date	Jun 26, 2020
Priority date	Jun 26, 2020
Publication date	Jan 14, 2025
Grant date	Jan 14, 2025

Abstract

A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet port. A second material is within a portion of the channel. The second material supplements the first material to modify the initial fluid path into a final fluid path between the fluid inlet port and the fluid outlet port. The second material may have a different composition and/or microstructure than the first material.

First claim

We claim:

1. A microfluidic device, comprising:
a channel of a width defined within a first material body to thermally couple with an IC die, wherein the channel defines a portion of an initial fluid path external of the first material body that extends between a fluid inlet port and a fluid outlet port, and wherein the channel is one of a plurality of continuous channels external of the first material body that are coupled in parallel between the fluid inlet port and to the fluid outlet port; and
a second material body within a length of the channel, wherein the second material body completely occludes fluid flow through an entirety of the width to alter the initial fluid path into a final fluid path consisting of a restricted portion of the channels external of the second material body, and wherein the second material body has a different composition or microstructure than the first material.

2. The microfluidic device of claim 1 , wherein the first material body is between lengths of adjacent ones of the channels, and wherein the second material body completely occludes the channel and confines the final fluid path to remaining ones of the plurality of channels.

3. The microfluidic device of claim 2 , wherein at least a portion of the second material body defines a baffle within the channel, the baffle having a cross-sectional area less than that of the channel.

4. The microfluidic device of claim 2 , wherein the second material body substantially fills a continuous length of the channel from a first point proximal the fluid outlet port to a second point proximal the fluid inlet port, and wherein the channel is substantially unrestricted by the second material body between the second point and the fluid inlet port.

5. The microfluidic device of claim 1 , wherein the first material body comprises a plurality of pillars, and wherein the second material unites two or more of the pillars.

6. The microfluidic device of claim 5 , wherein the plurality of pillars are spaced apart on a rectangular grid, and wherein the two or more of the pillars are within a single row or a single column of the rectangular grid.

7. The microfluidic device of claim 6 , wherein the second material body unifies all of the pillars within a row of the rectangular grid along a length between the fluid inlet port and the fluid outlet port.

8. The microfluidic device of claim 7 , wherein the second material body further unifies the row with one or more pillars of an adjacent row in the rectangular grid.

9. The microfluidic device of claim 1 , further comprising a lid affixed to at least the first material body, the lid enclosing the channel.

10. The microfluidic device of claim 1 , wherein the initial fluid path is independent of circuitry layout in the IC die, and wherein the final fluid path is based on the circuitry layout of the IC die.

11. The microfluidic device of claim 1 , wherein
the second material body has at least one of, a greater surface roughness, or a greater % voiding area than the first material body.

12. The microfluidic device of claim 11 , wherein the first material body has substantially zero % voiding area, and the second material body has a non-zero % voiding area less than 0.5%.

13. The microfluidic device of claim 11 , wherein at least one of the first and second bodies comprises at least one of: copper, silver, gold, aluminum, nickel, boron, carbon, silicon or nitrogen.

14. The microfluidic device of claim 13 , wherein a first of the first and second material bodies comprises at least a first of copper, silver, gold, aluminum, nickel, boron, carbon, silicon or nitrogen, and wherein a second of the first and second bodies comprises at least a second of copper, silver, gold, aluminum, nickel, boron, carbon, silicon or nitrogen.

15. An electronic device, comprising:
an IC die; and
the microfluidic device of claim 1 thermally coupled to the IC die.

16. The electronic device of claim 15 , further comprising:
a first fluid conduit coupled to the fluid inlet port;
a second fluid conduit coupled to the fluid outlet port;
a fluid reservoir coupled to the first and second fluid conduits; and
a pump coupled to at least one of the first or second fluid conduits.

17. The electronic device of claim 15 , wherein the first material body has substantially zero % voiding area, and the second material body has a non-zero % voiding area less than 0.5%.

18. The microfluidic device of claim 15 , wherein at least one of the first and second material bodies comprises at least one of: copper, silver, gold, aluminum, nickel, boron, carbon, silicon or nitrogen.

19. The microfluidic device of claim 18 , wherein a first of the first and second bodies comprises at least a first of copper, silver, gold, aluminum, nickel, boron, carbon, silicon or nitrogen, and wherein a second of the first and second bodies comprises at least a second of copper, silver, gold, aluminum, nickel, boron, carbon, silicon or nitrogen.

Assignees

• Intel Corp

Inventors

• Elsherbini Adel
• Morein Stephen
• Eid Feras
• Dogiamis Georgios

Classifications

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/253

  Semiconductors · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title