Method of forming package structure
US-2024347506-A1 · Oct 17, 2024 · US
This page is not indexed by search engines while we improve data quality.
Liao Ebin patents
Liao Ebin is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Liao Ebin |
| Total patents | 29 |
| First publication | Mar 5, 2015 |
| Latest publication | Oct 17, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Package structure and method of forming the same
US-12051672-B2 · Jul 30, 2024 · US
Semiconductor component having through-silicon vias
US-11545392-B2 · Jan 3, 2023 · US
Semiconductor component having through-silicon vias
US-2021005515-A1 · Jan 7, 2021 · US
Bonding apparatus and method of bonding substrates
US-10872874-B2 · Dec 22, 2020 · US
Method and apparatus for bonding semiconductor devices
US-10867831-B1 · Dec 15, 2020 · US
Method and Apparatus for Bonding Semiconductor Devices
US-2020373185-A1 · Nov 26, 2020 · US
Method of making a semiconductor component having through-silicon vias
US-10784162-B2 · Sep 22, 2020 · US
Package structure and method of forming the same
US-2020294966-A1 · Sep 17, 2020 · US
Method and apparatus for bonding semiconductor devices
US-10748803-B2 · Aug 18, 2020 · US
Recent patents
Latest publications not already listed above.
Semiconductor devices, methods of manufacture thereof, and capacitors
US-10727294-B2 · Jul 28, 2020 · US
Three-dimensional integrated circuit structure and method of manufacturing the same
US-10672737-B2 · Jun 2, 2020 · US
Bonding apparatus and method of bonding substrates
US-2019267347-A1 · Aug 29, 2019 · US
Method and Apparatus for Bonding Semiconductor Devices
US-2019244851-A1 · Aug 8, 2019 · US
Three-dimensional integrated circuit structure and method of manufacturing the same
US-2019139935-A1 · May 9, 2019 · US
Method and apparatus for bonding semiconductor devices
US-10269611-B1 · Apr 23, 2019 · US
Method of making a semiconductor component having through-silicon vias
US-2019067107-A1 · Feb 28, 2019 · US
Semiconductor component having through-silicon vias and method of manufacture
US-10115634-B2 · Oct 30, 2018 · US
Semiconductor Devices, Methods of Manufacture Thereof, and Capacitors
US-2018175137-A1 · Jun 21, 2018 · US
Semiconductor devices, methods of manufacture thereof, and capacitors
US-9899467-B2 · Feb 20, 2018 · US
Methods for forming a device having a capped through-substrate via structure
US-9847256-B2 · Dec 19, 2017 · US
Device with Through-Substrate Via Structure and Method for Forming the Same
US-2017084489-A1 · Mar 23, 2017 · US
Device with capped through-substrate via structure
US-9514986-B2 · Dec 6, 2016 · US
Semiconductor component having through-silicon vias and method of manufacture
US-2016329245-A1 · Nov 10, 2016 · US
Semiconductor component having through-silicon vias and method of manufacture
US-9418923-B2 · Aug 16, 2016 · US
Through substrate via structures and methods of forming the same
US-9263382-B2 · Feb 16, 2016 · US
Device with through-silicon via (TSV) and method of forming the same
US-9087878-B2 · Jul 21, 2015 · US
Semiconductor Devices, Methods of Manufacture Thereof, and Capacitors
US-2015162397-A1 · Jun 11, 2015 · US
Device with Through-Substrate Via Structure and Method for Forming the Same
US-2015061147-A1 · Mar 5, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 26 |
| Taiwan Semiconductor Mfg | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 18 |
| H10W20/0245 | 13 |
| H10W20/20 | 13 |
| H10W20/023 | 13 |
| H01L21/76898 | 13 |