Hybrid micro-bump integration with redistribution layer
US-11855028-B2 · Dec 26, 2023 · US
Taiwan Semiconductor Mfg holds 5,245 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 5,245 |
| Recent patents | 3 |
| First publication | Jan 1, 2015 |
| Latest publication | Dec 26, 2023 |
Year-over-year patent counts for this assignee.
Latest publications where this party is an assignee.
US-11855028-B2 · Dec 26, 2023 · US
US-2023377887-A1 · Nov 23, 2023 · US
US-11735426-B2 · Aug 22, 2023 · US
US-11652133-B2 · May 16, 2023 · US
US-2022359518-A1 · Nov 10, 2022 · US
Representative or frequently cited publications from precomputed assignee stats.
US-11855028-B2 · Dec 26, 2023 · US
US-2023377887-A1 · Nov 23, 2023 · US
US-11735426-B2 · Aug 22, 2023 · US
US-11652133-B2 · May 16, 2023 · US
US-2022359518-A1 · Nov 10, 2022 · US
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10D84/038 | 840 |
| H10W90/00 | 648 |
| H10W90/724 | 594 |
| H10D30/024 | 582 |
| H10W72/252 | 574 |
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4,557 |
| Physics | 1,266 |
| Operations & Transport | 347 |
| Cross-Sectional Technologies | 255 |
| Chemistry & Metallurgy | 103 |
| Mechanical Engineering | 10 |
| Human Necessities | 5 |
| Fixed Constructions | 3 |
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