Bonding apparatus and method of bonding substrates

Patent metadata

Field	Value
Publication number	US-10872874-B2
Application number	US-201816109769-A
Country	US
Kind code	B2
Filing date	Aug 23, 2018
Priority date	Feb 26, 2018
Publication date	Dec 22, 2020
Grant date	Dec 22, 2020

Abstract

A bonding apparatus includes a chuck and a bonding head. The chuck is configured to carry a plurality of substrates to be bonded. The bonding head has a cavity facing the chuck and includes a divider, at least one pneumatic component and a diaphragm. The divider is disposed in the cavity and dividing the cavity into a plurality of compartments. The at least one pneumatic component is disposed in at least one of the compartments. The diaphragm covers the cavity and is disposed between the at least one pneumatic component and the chuck.

First claim

What is claimed is:

1. A bonding apparatus, comprising:
a chuck configured to carry a plurality of substrates to be bonded; and
a bonding head having a cavity facing the chuck, comprising:
a divider disposed in the cavity and dividing the cavity into a plurality of compartments;
at least one pneumatic component disposed in at least one of the plurality of compartments; and
a diaphragm covering the cavity and disposed between the at least one pneumatic component and the chuck, wherein the diaphragm is configured to press against the plurality of substrates to be bonded when the at least one pneumatic component is inflated.

2. The bonding apparatus as claimed in claim 1 , wherein the bonding head further comprises at least one gas inlet in gas communication with the at least one pneumatic component to inflate or deflate the at least one pneumatic component.

3. The bonding apparatus as claimed in claim 1 , wherein the plurality of compartments comprises a central compartment and a peripheral compartment surrounding the central compartment.

4. The bonding apparatus as claimed in claim 3 , wherein the at least one pneumatic component comprises a central pneumatic component disposed in the central compartment and a peripheral pneumatic component disposed in the peripheral compartment.

5. The bonding apparatus as claimed in claim 3 , further comprising a pressing pin movably disposed in the central compartment, wherein the at least one pneumatic component is disposed in the peripheral compartment, and the diaphragm exposes the central compartment and covers the peripheral compartment.

6. The bonding apparatus as claimed in claim 3 , wherein the peripheral compartment further comprises a plurality of sub-compartments divided by the divider and together surrounding the central compartment.

7. The bonding apparatus as claimed in claim 6 , wherein the at least one pneumatic component comprises a central pneumatic component disposed in the central compartment and a plurality of peripheral pneumatic components disposed in the plurality of sub-compartments respectively.

8. The bonding apparatus as claimed in claim 3 , wherein the peripheral compartment further comprises a plurality of concentric compartments divided by the divider and arranged in a concentric manner with respect to the central compartment.

9. The bonding apparatus as claimed in claim 8 , wherein the at least one pneumatic component comprises a central pneumatic component disposed in the central compartment and a plurality of peripheral pneumatic components disposed in the plurality of concentric compartments respectively.

10. The bonding apparatus as claimed in claim 1 wherein a diameter of the cavity is substantially greater than a diameter of each of the plurality of substrates to be bonded.

11. A bonding apparatus, comprising:
a chuck configured to carry a plurality of substrates to be bonded; and
a bonding head having a cavity facing the chuck, wherein the chuck and the bonding head are configured to be movable relative to each other, and the bonding head comprises:
a divider disposed in the cavity and dividing the cavity into a central compartment and a peripheral compartment surrounding the central compartment;
at least one peripheral pneumatic component disposed in the peripheral compartment; and
a diaphragm covering the cavity and disposed between the at least one peripheral pneumatic component and the chuck, wherein the diaphragm is configured to press against the plurality of substrates to be bonded when the at least one peripheral pneumatic components are inflated.

12. The bonding apparatus as claimed in claim 11 , further comprising a central pneumatic component disposed in the central compartment.

13. The bonding apparatus as claimed in claim 11 , further comprising a pressing pin movably disposed in central compartment, wherein the diaphragm exposes the central compartment and covers the peripheral compartment.

14. The bonding apparatus as claimed in claim 11 , wherein the peripheral compartment further comprises a plurality of sub-compartments divided by the divider and together surrounding the central compartment, the at least one peripheral pneumatic component comprises a plurality of peripheral pneumatic components disposed in the plurality of sub-compartments respectively.

15. The bonding apparatus as claimed in claim 11 , wherein the peripheral compartment further comprises a plurality of concentric compartments divided by the divider and arranged in a concentric manner with respect to the central compartment, the at least one peripheral pneumatic component comprises a plurality of peripheral pneumatic components disposed in the plurality of concentric compartments respectively.

16. The bonding apparatus as claimed in claim 11 , wherein a diameter of the cavity is substantially greater than a diameter of each of the plurality of substrates to be bonded.

17. A bonding apparatus, comprising:
a chuck configured to carry a plurality of substrates to be bonded; and
a bonding head having a plurality of compartments facing the chuck, at least one pneumatic component disposed in at least one of the plurality of compartments and configured to be inflated or deflated, and a diaphragm covering the at least one pneumatic component.

18. The bonding apparatus as claimed in claim 17 , wherein the plurality of compartments comprises a central compartment and a peripheral compartment surrounding the central compartment, and the at least one pneumatic component at least disposed in the peripheral compartment.

19. The bonding apparatus as claimed in claim 17 , wherein the chuck further comprises a positioning cavity facing the bonding head and corresponding to the cavity of the bonding head.

20. The bonding apparatus as claimed in claim 19 , wherein the chuck further comprises a positioning mechanism movably disposed in the positioning cavity to hold the plurality of substrates to be bonded in place.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Yu Chen-Hua
• Liao Ebin
• Chiou Wen-Chih

Classifications

• H10W72/07163

  Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/07188

  Apparatus chuck · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/792

  between multiple chips · CPC title