Sub-ground rule e-Fuse structure
US-11121082-B2 · Sep 14, 2021 · US
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Kim Andrew T patents
Kim Andrew T is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kim Andrew T |
| Total patents | 23 |
| First publication | Apr 30, 2015 |
| Latest publication | Sep 14, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Sub-ground rule e-fuse structure
US-2020335440-A1 · Oct 22, 2020 · US
Wafer rigidity with reinforcement structure
US-10325862-B2 · Jun 18, 2019 · US
Wafer reinforcement to reduce wafer curvature
US-10304783-B2 · May 28, 2019 · US
Three plate MIM capacitor via integrity verification
US-10262934-B2 · Apr 16, 2019 · US
Three plate MIM capacitor via integrity verification
US-10229873-B2 · Mar 12, 2019 · US
Three plate mim capacitor via integrity verification
US-2018226339-A1 · Aug 9, 2018 · US
Three plate mim capacitor via integrity verification
US-2018226338-A1 · Aug 9, 2018 · US
Wafer rigidity with reinforcement structure
US-2018019214-A1 · Jan 18, 2018 · US
Wafer reinforcement to reduce wafer curvature
US-2018005961-A1 · Jan 4, 2018 · US
Recent patents
Latest publications not already listed above.
Wafer reinforcement to reduce wafer curvature
US-9852999-B2 · Dec 26, 2017 · US
Interconnect reliability structures
US-9817063-B2 · Nov 14, 2017 · US
Wafer rigidity with reinforcement structure
US-9761539-B2 · Sep 12, 2017 · US
Interconnect reliability structures
US-2017242067-A1 · Aug 24, 2017 · US
Wafer reinforcement to reduce wafer curvature
US-2017098616-A1 · Apr 6, 2017 · US
Wafer rigidity with reinforcement structure
US-2016379934-A1 · Dec 29, 2016 · US
Mechanically anchored backside C4 pad
US-9478509-B2 · Oct 25, 2016 · US
Integrated circuit (IC) test structure with monitor chain and test wires
US-9435852-B1 · Sep 6, 2016 · US
Graphene-metal E-fuse
US-9431346-B2 · Aug 30, 2016 · US
Integrated circuit structure with metal cap and methods of fabrication
US-9318413-B2 · Apr 19, 2016 · US
E-fuse with hybrid metallization
US-9305879-B2 · Apr 5, 2016 · US
Mechanically anchored backside c4 pad
US-2015255410-A1 · Sep 10, 2015 · US
Integrated circuit structure with metal cap and methods of fabrication
US-2015115459-A1 · Apr 30, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 16 |
| Globalfoundries Inc | 12 |
| Globalfoundries Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W42/121 | 8 |
| H01L23/562 | 8 |
| H10W20/42 | 8 |
| H01L23/5226 | 8 |
| H10W20/20 | 8 |