Semiconductor package
US-2026096486-A1 · Apr 2, 2026 · US
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Jo Chajea patents
Jo Chajea is listed as an inventor on 81 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jo Chajea |
| Total patents | 81 |
| First publication | Jan 26, 2016 |
| Latest publication | Apr 2, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package and method of manufacturing the same
US-12581931-B2 · Mar 17, 2026 · US
Semiconductor package
US-2026068741-A1 · Mar 5, 2026 · US
Memory device
US-12543600-B2 · Feb 3, 2026 · US
Semiconductor package
US-2025372537-A1 · Dec 4, 2025 · US
Semiconductor package
US-2025273554-A1 · Aug 28, 2025 · US
Semiconductor package
US-12400980-B2 · Aug 26, 2025 · US
Semiconductor package
US-12327784-B2 · Jun 10, 2025 · US
Semiconductor package
US-2025149479-A1 · May 8, 2025 · US
Semiconductor package and method of testing the same
US-2025096047-A1 · Mar 20, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor package having dielectric layer with step difference
US-2025096208-A1 · Mar 20, 2025 · US
Semiconductor package and method of fabricating the same
US-2025022828-A1 · Jan 16, 2025 · US
Semiconductor package and method of manufacturing the same
US-2024429192-A1 · Dec 26, 2024 · US
Semiconductor package and method of fabricating the same
US-2024355780-A1 · Oct 24, 2024 · US
Semiconductor package
US-2024243111-A1 · Jul 18, 2024 · US
Semiconductor package including semiconductor chip having through-electrode
US-2024194575-A1 · Jun 13, 2024 · US
Semiconductor package
US-2024170464-A1 · May 23, 2024 · US
Semiconductor package
US-11990452-B2 · May 21, 2024 · US
Semiconductor package
US-2024162188-A1 · May 16, 2024 · US
Semiconductor package
US-2024113057-A1 · Apr 4, 2024 · US
Semiconductor package and method of manufacturing the same
US-11942446-B2 · Mar 26, 2024 · US
Semiconductor package
US-2024088075-A1 · Mar 14, 2024 · US
Semiconductor package
US-11923342-B2 · Mar 5, 2024 · US
Semiconductor package and method of manufacturing the same
US-2024055406-A1 · Feb 15, 2024 · US
Integrated circuit device and semiconductor package including the same
US-11887913-B2 · Jan 30, 2024 · US
Semiconductor package and method of manufacturing the same
US-2024006272-A1 · Jan 4, 2024 · US
Semiconductor package
US-11848293-B2 · Dec 19, 2023 · US
Semiconductor package including an image sensor chip and a method of fabricating the same
US-11824076-B2 · Nov 21, 2023 · US
Semiconductor package
US-11776941-B2 · Oct 3, 2023 · US
Semiconductor package
US-2023215842-A1 · Jul 6, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 81 |
| Jo Chajea | 4 |
| Cho Taeje | 4 |
| Seo Sunkyoung | 1 |
| Kim Ji Hwang | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 76 |
| H10W90/722 | 66 |
| H10W90/724 | 56 |
| H10W90/297 | 49 |
| H10W72/20 | 44 |