Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line
US-10192855-B2 · Jan 29, 2019 · US
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Cho Taeje patents
Cho Taeje holds 8 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 8 |
| Recent patents | 0 |
| First publication | May 5, 2015 |
| Latest publication | Jan 29, 2019 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Semiconductor package and method of fabricating the same
US-10186500-B2 · Jan 22, 2019 · US
Method of fabricating a semiconductor device
US-10157766-B2 · Dec 18, 2018 · US
Semiconductor package and method of fabricating the same
US-9905550-B2 · Feb 27, 2018 · US
Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same
US-9875992-B2 · Jan 23, 2018 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line
US-10192855-B2 · Jan 29, 2019 · US
Semiconductor package and method of fabricating the same
US-10186500-B2 · Jan 22, 2019 · US
Method of fabricating a semiconductor device
US-10157766-B2 · Dec 18, 2018 · US
Semiconductor package and method of fabricating the same
US-9905550-B2 · Feb 27, 2018 · US
Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same
US-9875992-B2 · Jan 23, 2018 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 8 |