Multi-purpose IO pads/bumps on semiconductor chips to maximize chip-to-chip data connectivity
US-12182051-B1 · Dec 31, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/20 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 19,431 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 1,277 |
| 2016 | 1,254 |
| 2017 | 1,359 |
| 2018 | 1,393 |
| 2019 | 1,510 |
| 2020 | 1,765 |
| 2021 | 1,733 |
| 2022 | 1,734 |
| 2023 | 2,236 |
| 2024 | 2,661 |
| 2025 | 2,000 |
| 2026 | 509 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
Semiconductor package
US-2024404970-A1 · Dec 5, 2024 · US
Method of manufacturing a semiconductor package having conductive pillars
US-2024387343-A1 · Nov 21, 2024 · US
Semiconductor Package and Method of Manufacturing The Same
US-2024387196-A1 · Nov 21, 2024 · US
Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices
US-12142594-B2 · Nov 12, 2024 · US
Semiconductor packages
US-2024363472-A1 · Oct 31, 2024 · US
Semiconductor package
US-2024355796-A1 · Oct 24, 2024 · US
Semiconductor package and method of manufacturing the semiconductor package
US-2024332150-A1 · Oct 3, 2024 · US
Semiconductor device and method of integrating power module with interposer and opposing substrates
US-2024304603-A1 · Sep 12, 2024 · US
Semiconductor package
US-2024297150-A1 · Sep 5, 2024 · US
Package substrate having porous dielectric layer
US-2024282693-A1 · Aug 22, 2024 · US
Flux, substrate and manufacturing method, and device
US-2024282737-A1 · Aug 22, 2024 · US
Semiconductor substrate and manufacturing method thereof
US-2024274520-A1 · Aug 15, 2024 · US
Electronic package and manufacturing method thereof
US-2024274519-A1 · Aug 15, 2024 · US
Selective etching process for SiGe and doped epitaxial silicon
US-12062571-B2 · Aug 13, 2024 · US
Semiconductor package including ball grid array connections with improved reliability
US-2024258258-A1 · Aug 1, 2024 · US
Semiconductor package
US-2024234342-A9 · Jul 11, 2024 · US
Stacked inorganic-organic dielectrics for thin film capacitors in package substrates
US-2024222295-A1 · Jul 4, 2024 · US
Tsv-type embedded multi-die interconnect bridge enabling with thermal compression non-conductive film (tc-ncf) process
US-2024213164-A1 · Jun 27, 2024 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/20?
- CPC H10W72/20 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10W72/20 (Electricity)?
- Our database includes 19,431 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/20 growing?
- Publication counts under this code: 2,661 in 2024 vs 2,000 in 2025 (latest complete years).