Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line
US-10192855-B2 · Jan 29, 2019 · US
Kim Ji Hwang holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Dec 1, 2015 |
| Latest publication | Jan 29, 2019 |
Year-over-year patent counts for this assignee.
Latest publications where this party is an assignee.
Representative or frequently cited publications from precomputed assignee stats.
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/724 | 3 |
| H10W90/00 | 3 |
| H01L2224/16225 | 3 |
| H10W90/297 | 2 |
| H10W20/023 | 2 |
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |
| Operations & Transport | 1 |