Electronic module including a semiconductor package disposed on an interposer layer
US-12438063-B2 · Oct 7, 2025 · US
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Hable Wolfram patents
Hable Wolfram is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hable Wolfram |
| Total patents | 29 |
| First publication | Mar 26, 2015 |
| Latest publication | Oct 7, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
An electronic module including a semiconductor package disposed on an interposer layer
US-2024194566-A1 · Jun 13, 2024 · US
Electronic module including a semiconductor package connected to a fluid heatsink
US-11955407-B2 · Apr 9, 2024 · US
Fluid-cooled package having shielding layer
US-11862533-B2 · Jan 2, 2024 · US
Power module comprising two substrates and method of manufacturing the same
US-11574889-B2 · Feb 7, 2023 · US
Fluid-Cooled Package Having Shielding Layer
US-2022115293-A1 · Apr 14, 2022 · US
Package cooled with cooling fluid and comprising shielding layer
US-11244886-B2 · Feb 8, 2022 · US
Electronic module including a semiconductor package connected to a fluid heatsink
US-2021225734-A1 · Jul 22, 2021 · US
Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
US-10615097-B2 · Apr 7, 2020 · US
Package with partially encapsulated cooling channel for cooling an encapsulated chip
US-10461017-B2 · Oct 29, 2019 · US
Recent patents
Latest publications not already listed above.
Molded package with chip carrier comprising brazed electrically conductive layers
US-10283432-B2 · May 7, 2019 · US
Molded package with chip carrier comprising brazed electrically conductive layers
US-2019006260-A1 · Jan 3, 2019 · US
Package with vertically spaced partially encapsulated contact structures
US-10128165-B2 · Nov 13, 2018 · US
Semiconductor chip package comprising laterally extending connectors
US-10079195-B2 · Sep 18, 2018 · US
Molded package with chip carrier comprising brazed electrically conductive layers
US-10074590-B1 · Sep 11, 2018 · US
Electronic module comprising fluid cooling channel and method of manufacturing the same
US-10037972-B2 · Jul 31, 2018 · US
Package with vertically spaced partially encapsulated contact structures
US-2018122720-A1 · May 3, 2018 · US
Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
US-2018102302-A1 · Apr 12, 2018 · US
Package cooled with cooling fluid and comprising shielding layer
US-2018082925-A1 · Mar 22, 2018 · US
Package with partially encapsulated cooling channel for cooling an encapsulated chip
US-2018040537-A1 · Feb 8, 2018 · US
Semiconductor chip package comprising laterally extending connectors
US-2017200666-A1 · Jul 13, 2017 · US
Electronic module and method of manufacturing the same
US-2017154835-A1 · Jun 1, 2017 · US
Electronic module and method of manufacturing the same
US-9589922-B2 · Mar 7, 2017 · US
Substrate, chip arrangement, and method for manufacturing the same
US-9585241-B2 · Feb 28, 2017 · US
Electronic module comprising fluid cooling channel and method of manufacturing the same
US-2016322333-A1 · Nov 3, 2016 · US
Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
US-9397018-B2 · Jul 19, 2016 · US
Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
US-9275926-B2 · Mar 1, 2016 · US
Electronic module and method of manufacturing the same
US-2015264796-A1 · Sep 17, 2015 · US
Substrate, chip arrangement, and method for manufacturing the same
US-2015085446-A1 · Mar 26, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 25 |
| Infineon Technologies Austria Ag | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/255 | 21 |
| H10W72/884 | 17 |
| H10W90/00 | 17 |
| H10W90/734 | 16 |
| H10W40/47 | 15 |