Package cooled with cooling fluid and comprising shielding layer

Patent metadata

Field	Value
Publication number	US-11244886-B2
Application number	US-201715710852-A
Country	US
Kind code	B2
Filing date	Sep 21, 2017
Priority date	Sep 21, 2016
Publication date	Feb 8, 2022
Grant date	Feb 8, 2022

Abstract

A package which comprises at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and a shielding layer on at least part of an external surface of the encapsulant configured for shielding an interior of the package with regard to cooling fluid for removing thermal energy from the at least one electronic chip.

First claim

What is claimed is:

1. A package, comprising:
at least one electronic chip;
an encapsulant encapsulating at least part of the at least one electronic chip;
a shielding layer on at least part of an external surface of the encapsulant; and
a first heat removal body thermally coupled to the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip to a cooling fluid,
wherein the first heat removal body comprises an electrically insulating layer having a first main surface and a second main surface opposite to the first main surface,
wherein the first main surface is covered by a first electrically conductive layer and the second main surface is covered by a second electrically conductive layer,
wherein the encapsulant has a surface portion that extends in a surface region extending laterally directly adjacent to the first heat removal body,
wherein the surface portion of the encapsulant delimits part of a cooling cavity configured to guide the cooling fluid,
wherein the shielding layer covers the surface portion of the encapsulant.

2. The package according to claim 1 , wherein the material of the shielding layer is configured to provide at least one property selected from the group consisting of:
corrosion resistance;
impermeability for a liquid, in particular for water and/or an organic solvent such as glycol;
abrasion resistance; and
fissure bridging capability.

3. The package according to claim 1 , wherein the material of the shielding layer comprises at least one of:
an organic dielectric material, in particular parylene;
an organic electrically conductive material, in particular an electrically conductive polymer;
an inorganic dielectric material, in particular a low-temperature glass; and
a metallic material, in particular at least one of the group consisting of titanium, nickel, aluminum, titanium-nickel, titanium-aluminum, and titanium-aluminum-nickel.

4. The package according to claim 1 , further comprising a second heat removal body thermally coupled to a second main surface of the at least one electronic chip or of at least one further electronic chip of the package and configured for removing thermal energy from the at least one electronic chip or from the at least one further electronic chip to the cooling fluid.

5. The package according to claim 4 , wherein at least a portion of a surface of at least one of the first heat removal body and the second heat removal body is covered by part of the shielding layer or by at least one further shielding layer.

6. The package according to claim 4 , wherein the second heat removal body comprises an electrically insulating layer having a first main surface covered by a first electrically conductive layer and having a second main surface covered by a second electrically conductive layer.

7. The package according to claim 1 , further comprising a cooling fin body on the first heat removal body.

8. The package according to claim 7 , further comprising a shielding layer on at least part of an external surface of the cooling fin body.

9. The package according to claim 1 , wherein the encapsulant is covered by the shielding layer in a surface region directly adjacent to the first heat removal body.

10. An electronic device, comprising:
a package according to claim 1 ; and
a cooling member configured for being mounted on the package to thereby delimit, together with the package, the cooling cavity for accommodating cooling fluid for cooling the package.

11. The electronic device according to claim 10 , wherein the package comprises at least one heat removal body each thermally coupled to a respective main surface of at least one of the at least one electronic chip and configured for removing thermal energy from the respective at least one electronic chip to the cooling fluid, wherein the cooling cavity is delimited, in particular exclusively, by the cooling member, by the shielding layer on the encapsulant and by the at least one heat removal body with or without shielding layer thereon.

12. The electronic device according to claim 10 , wherein the surface portion of the encapsulant covered with the shielding layer is shaped to form a structural feature contributing to a cooling fluid related function.

13. The electronic device according to claim 12 , wherein the structural feature comprises at least one of:
a sealing groove for accommodating a sealing member for promoting fluid-tightness of the cooling cavity; and
a cooling fluid guiding structure for guiding the cooling fluid along a defined flow path.

14. The electronic device according to claim 10 , wherein the cooling member is configured for being mounted on the package for double-sided cooling of the package by the cooling fluid being thermally couplable with two opposing main surfaces of the package.

15. The electronic device according to claim 10 , wherein the cooling member comprises at least one of a cooling medium supply channel configured for supplying the cooling fluid to the cooling cavity, and a cooling medium drain channel configured for draining the cooling fluid from the cooling cavity.

16. A method of using an electronic device according to claim 10 for an automotive application, as an inverter circuit for an at least partially electrically driven vehicle.

17. A method of manufacturing an electronic device, the method comprising:
providing a package according to claim 1 ; and
mounting a cooling member on the package to thereby delimit, together with the package, the cooling cavity.

18. A vehicle, comprising a package according to claim 1 .

19. A method of manufacturing a package, the method comprising:
encapsulating at least part of at least one electronic chip by an encapsulant;
forming a shielding layer on at least part of an external surface of the encapsulant;
forming a first heat removal body thermally coupled to the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip to a cooling fluid,
wherein the first heat removal body comprises an electrically insulating layer having a first main surface and a second main surface opposite to the first main surface,
wherein the first main surface is covered by a first electrically conductive layer and the second main surface is covered by a second electrically conductive layer,
wherein the encapsulant has a surface portion that extends in a surface region extending laterally directly adjacent to the first heat removal body,
wherein the surface portion of the encapsulant delimits part of a cooling cavity configured to guide the cooling fluid,
wherein forming the shielding layer on at least part of the external surface of the encapsulant comprises covering the surface portion of the encapsulant that delimits part of the cooling cavity with the shielding layer.

20. The method according to claim 19 , wherein the shielding layer is manufactured by at least one of:
sputtering;
deposition, in particular chemical deposition, such as plating, or deposition by evaporation;
chemical vapor deposition;
low-temperature melting, in particular by laser processing;
varnishing; and
plasma deposition.

21. The method according to claim 19 , further comprising roughening the surface portion of the encapsulant, prior to covering the surface portion of the encapsulant that delimits part of the cooling cavity with the shielding layer.

22. An electronic device, comprising:
a package c

Assignees

• Infineon Technologies Ag

Inventors

• Grassmann Andreas
• Hable Wolfram
• Hoegerl Juergen
• Nikitin Ivan
• Strass Achim

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title