Electronic module and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9589922-B2
Application number	US-201414214962-A
Country	US
Kind code	B2
Filing date	Mar 16, 2014
Priority date	Mar 16, 2014
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.

First claim

What is claimed is:

1. An electronic module comprising,
a first conductive board;
an electronic chip comprising at least one electronic component and arranged on the first conductive board,
a spacing element arranged on the electronic chip and being in conductive connection with the at least one electronic component;
a second conductive board arranged on the spacer spacing element; and
a mold compound enclosing the electronic chip and the spacing element at least partially and wherein the mold has a coefficient of thermal expansion value of x ppm/K;
wherein the spacing element comprises a material having a coefficient of thermal expansion value laying in a range between (x−4)ppm/K and (x+4)ppm/K.

2. The electronic module according to claim 1 , wherein the first conductive board comprising a material selected out of the group consisting of:
copper, and
aluminium.

3. The electronic module according to claim 1 , wherein the second conductive board comprising a material selected out of the group consisting of:
copper, and
aluminium.

4. The electronic module according to claim 1 , wherein the coefficient of thermal expansion of the spacing element material is lower than 16 ppm/K.

5. The electronic module according to claim 1 , wherein the spacing element material coefficient of thermal expansion value is substantially matched with a coefficient of thermal expansion value of the mold compound.

Assignees

• Infineon Technologies Ag

Inventors

• Neugirg Christian
• Grassmann Andreas
• Hable Wolfram
• Geitner Ottmar
• Winter Frank
• Schwarz Alexander
• Yoo Inpil

Classifications

• H10W90/763

  between laterally-adjacent chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07636

  Soldering or alloying · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title