Doping processes in metal interconnect structures
US-2026068630-A1 · Mar 5, 2026 · US
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Dordi Yezdi patents
Dordi Yezdi is listed as an inventor on 45 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Dordi Yezdi |
| Total patents | 45 |
| First publication | Feb 5, 2015 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Doping processes in metal interconnect structures
US-12564039-B2 · Feb 24, 2026 · US
Zincating and doping of metal liner for liner passivation and adhesion improvement
US-11984354-B2 · May 14, 2024 · US
Combined self-forming barrier and seed layer by atomic layer deposition
US-2023298936-A1 · Sep 21, 2023 · US
Doping processes in metal interconnect structures
US-2022415819-A1 · Dec 29, 2022 · US
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment
US-11225714-B2 · Jan 18, 2022 · US
Zincating and doping of metal liner for liner passivation and adhesion improvement
US-2021166971-A1 · Jun 3, 2021 · US
Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias
US-10640874-B2 · May 5, 2020 · US
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment
US-2020063256-A1 · Feb 27, 2020 · US
Layer-by-layer deposition using hydrogen
US-10508351-B2 · Dec 17, 2019 · US
Recent patents
Latest publications not already listed above.
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment
US-10501846-B2 · Dec 10, 2019 · US
Via prefill in a fully aligned via
US-2019363048-A1 · Nov 28, 2019 · US
Self-forming barrier process
US-10483163-B2 · Nov 19, 2019 · US
Self-forming barrier process
US-2019122922-A1 · Apr 25, 2019 · US
Interlevel conductor pre-fill utilizing selective barrier deposition
US-10262943-B2 · Apr 16, 2019 · US
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment
US-2019078202-A1 · Mar 14, 2019 · US
Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias
US-2019048472-A1 · Feb 14, 2019 · US
Self-forming barrier process
US-2018374747-A1 · Dec 27, 2018 · US
Self-forming barrier process
US-10163695-B1 · Dec 25, 2018 · US
Layer-by-layer deposition using hydrogen
US-2018266001-A1 · Sep 20, 2018 · US
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
US-2018151503-A1 · May 31, 2018 · US
Interlevel conductor pre-fill utilizing selective barrier deposition
US-9875968-B2 · Jan 23, 2018 · US
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
US-2017162512-A1 · Jun 8, 2017 · US
Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate
US-2017073815-A1 · Mar 16, 2017 · US
Interlevel conductor pre-fill utilizing selective barrier deposition
US-9583386-B2 · Feb 28, 2017 · US
Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
US-9499913-B2 · Nov 22, 2016 · US
Highly selective deposition of amorphous carbon as a metal diffusion barrier layer
US-2016329213-A1 · Nov 10, 2016 · US
Selective deposition and co-deposition processes for ferromagnetic thin films
US-9476124-B2 · Oct 25, 2016 · US
Electroless deposition of continuous platinum layer
US-9469902-B2 · Oct 18, 2016 · US
Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents
US-9428836-B2 · Aug 30, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 45 |
| Redeker Fritz C | 3 |
| Dordi Yezdi | 3 |
| Yoon Hyungsuk Alexander | 2 |
| Hemker David | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/076 | 21 |
| H10W20/056 | 20 |
| H10W20/425 | 19 |
| H10W20/033 | 19 |
| H10P14/46 | 19 |