Layer-by-layer deposition using hydrogen

Patent metadata

Field	Value
Publication number	US-10508351-B2
Application number	US-201815913542-A
Country	US
Kind code	B2
Filing date	Mar 6, 2018
Priority date	Mar 16, 2017
Publication date	Dec 17, 2019
Grant date	Dec 17, 2019

Abstract

Layer-by-layer thickness control of an electroplated film can be achieved by using a cyclic deposition process. The cyclic process involves forming a layer (or partial layer) of hydrogen on a surface of the substrate, then displacing the layer of hydrogen with a layer of metal. These steps are repeated a number of times to deposit the metal film to a desired thickness. Each step in the cycle is self-limiting, thereby enabling atomic level thickness control.

First claim

What is claimed is:

1. A method of depositing a solid material on a substrate, the method comprising:
(a) forming a layer or a partial layer of hydrogen on a surface of the substrate, wherein forming the layer or partial layer of hydrogen comprises reducing hydrogen on the surface of the substrate by contacting the surface of the substrate with hydrogen radicals; and
(b) contacting the surface of the substrate with a solution comprising an ion of a material, whereby ions of the material and the hydrogen react to produce no more than about a monolayer of the material on the surface of the substrate to produce a layer or a partial layer of the material on the surface of the substrate.

2. The method of claim 1 , further comprising repeating (a) and (b) on the surface of the substrate.

3. The method of claim 1 , further comprising repeating (a) and (b) on the surface of the substrate at least about five times.

4. The method of claim 1 , further comprising repeating (a) and (b) on the surface of the substrate to form a layer of the material having a thickness of between about 0.5 to 5 nanometers.

5. The method of claim 1 , wherein the layer or partial layer of hydrogen formed in (a) has a thickness no greater than about a monolayer.

6. The method of claim 1 , wherein (a) comprises adsorbing the hydrogen on the surface of the substrate.

7. The method of claim 1 , wherein (a) is performed in an apparatus comprising a chamber having a pedestal configured to support the substrate, and a remote plasma source in communication with the chamber and configured to produce hydrogen radicals.

8. The method of claim 1 , wherein the surface of the substrate has recessed features, at least some of which have an aspect ratio of at least about three.

9. The method of claim 1 , wherein the surface of the substrate comprises electrically conductive regions or is entirely electrically conductive.

10. The method of claim 1 , wherein the surface of the substrate comprises a partially fabricated semiconductor device.

11. The method of claim 1 , wherein the material is electrically conductive.

12. The method of claim 1 , wherein the material is a metal.

13. The method of claim 12 , wherein the metal and its ion has an equilibrium electrochemical reduction potential that is more positive than the equilibrium electrochemical reduction potential of hydrogen gas and aqueous hydrogen ions.

14. The method of claim 12 , wherein the metal is selected from the group consisting of gold, copper, silver, germanium, tin, arsenic, bismuth, mercury, palladium, lead, platinum, rhenium, and molybdenum, ruthenium, and combinations thereof.

15. The method of claim 1 , wherein the solution comprising the ion of the material is an aqueous solution.

16. The method of claim 1 , wherein (a) and (b) are performed in different reaction vessels.

17. A method of depositing a solid material on a substrate, the method comprising:
(a) forming a layer or a partial layer of hydrogen on a surface of the substrate, wherein forming the layer or partial layer of hydrogen comprises reducing hydrogen on the surface of the substrate by contacting the surface of the substrate with hydrogen species in a plasma; and
(b) contacting the surface of the substrate with a solution comprising an ion of a material, whereby ions of the material and the hydrogen react to produce no more than about a monolayer of the material on the surface of the substrate to produce a layer or a partial layer of the material on the surface of the substrate.

18. A method of depositing a solid material on a substrate, the method comprising:
(a) forming a layer or a partial layer of hydrogen on a surface of the substrate; and
(b) contacting the surface of the substrate with a solution comprising an ion of a material, whereby ions of the material and the hydrogen react to produce no more than about a monolayer of the material on the surface of the substrate to produce a layer or a partial layer of the material on the surface of the substrate, wherein (a) is performed in an apparatus comprising a chamber having a pedestal configured to support the substrate, and a remote plasma source in communication with the chamber and configured to produce hydrogen radicals.

19. The method of claim 18 , wherein (b) is performed in an apparatus comprising electrical contacts configured to electrically couple the surface of the substrate to an external circuit, a counter electrode electrically coupled to the external circuit, and a vessel configured to contain the solution comprising the ion of the material.

20. The method of claim 18 , wherein (a) comprises adsorbing the hydrogen on the surface of the substrate.

Assignees

• Lam Res Corp

Inventors

• Joi Aniruddha
• Dordi Yezdi

Classifications

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D9/08

  by cathodic processes · CPC title

• C25D9/00

  Electrolytic coating other than with metals (C25D11/00, C25D15/00 take precedence; electrophoretic coating C25D13/00) · CPC title

• C25D5/48

  After-treatment of electroplated surfaces · CPC title

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title