Bonding through multi-shot laser reflow
US-12581977-B2 · Mar 17, 2026 · US
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Cheng Chia-Shen patents
Cheng Chia-Shen is listed as an inventor on 79 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cheng Chia-Shen |
| Total patents | 79 |
| First publication | Nov 1, 2016 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Package structure
US-12564054-B2 · Feb 24, 2026 · US
Package structure and method of fabricating the same
US-12564055-B2 · Feb 24, 2026 · US
Optical engine module with fiber array unit and methods for forming the same
US-2025389915-A1 · Dec 25, 2025 · US
Inspection tool for fiber array unit (fau) quality monitoring in the co-packaged optics application and methods for inspecting using the same
US-2025383260-A1 · Dec 18, 2025 · US
Semiconductor package and method of forming the same
US-2025372491-A1 · Dec 4, 2025 · US
Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure
US-12489030-B2 · Dec 2, 2025 · US
Novel structure integrated with optical interface engine
US-2025349815-A1 · Nov 13, 2025 · US
Optical device and method of manufacture
US-2025347870-A1 · Nov 13, 2025 · US
Integrated circuit packages and methods of forming the same
US-2025343128-A1 · Nov 6, 2025 · US
Recent patents
Latest publications not already listed above.
Wafer singulation including multiple laser grooving
US-2025336678-A1 · Oct 30, 2025 · US
Wafer singulation including multiple laser grooving
US-2025323041-A1 · Oct 16, 2025 · US
Methods of forming semiconductor packages
US-2025316670-A1 · Oct 9, 2025 · US
Method for laser drilling process for an integrated circuit package
US-2025308933-A1 · Oct 2, 2025 · US
Methods of forming semiconductor packages
US-12368149-B2 · Jul 22, 2025 · US
Method for laser drilling process for an integrated circuit package
US-12368053-B2 · Jul 22, 2025 · US
Semiconductor package and manufacturing method of the same
US-2025233111-A1 · Jul 17, 2025 · US
Workpiece holder, wafer chuck, wafer holding method
US-2025201621-A1 · Jun 19, 2025 · US
Semiconductor package and manufacturing method thereof
US-2025192011-A1 · Jun 12, 2025 · US
Co-packaged optics device and opto-electronic module
US-2025172777-A1 · May 29, 2025 · US
Photonic system with removable fiber array unit assembly and method of forming the same
US-2025172774-A1 · May 29, 2025 · US
Package assembly and manufacturing method thereof
US-2025147245-A1 · May 8, 2025 · US
Semiconductor package and manufacturing method thereof
US-2025118716-A1 · Apr 10, 2025 · US
Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece
US-12266559-B2 · Apr 1, 2025 · US
Optical device and method of manufacture
US-2025093593-A1 · Mar 20, 2025 · US
Structure integrated with optical interface engine
US-2025087652-A1 · Mar 13, 2025 · US
Reflow method and system
US-2025070077-A1 · Feb 27, 2025 · US
Reflow method and system
US-12176319-B2 · Dec 24, 2024 · US
Integrated circuit packages and methods of forming the same
US-2024387346-A1 · Nov 21, 2024 · US
Bonding through multi-shot laser reflow
US-12040309-B2 · Jul 16, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 83 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/60 | 52 |
| H10W70/09 | 51 |
| H10P72/74 | 50 |
| H10P72/7424 | 48 |
| H10W74/117 | 47 |