Bonding through multi-shot laser reflow

Patent metadata

Field	Value
Publication number	US-12581977-B2
Application number	US-202418613954-A
Country	US
Kind code	B2
Filing date	Mar 22, 2024
Priority date	Mar 12, 2018
Publication date	Mar 17, 2026
Grant date	Mar 17, 2026

Abstract

A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

First claim

What is claimed is:

1 . A method comprising:
providing a substrate and disposing a first device on a first upper surface of the substrate; and irradiating a second upper surface of the first device with an energy beam to form bonding joints between an interface of the substrate and the first device, wherein prior to the irradiation, a center of the energy beam is shifted from being substantially aligned with a center of the second upper surface of the first device toward a position having a relatively low temperature in a temperature distribution of the second upper surface of the first device.

2 . The method of claim 1 further comprising bonding a second device to the substrate, wherein the second device is disposed adjacent to the first device.

3 . The method of claim 1 further comprising shifting the center of the energy beam from an edge portion of the second upper surface of the first device to the center of the second upper surface of the first device.

4 . The method of claim 1 , wherein at a starting time the center of the energy beam is shifted, a solder region between the substrate and the first device is molten, and wherein during a period of time the center of the energy beam has been shifted, the solder region is solidified.

5 . The method of claim 1 , wherein:
at a first time the center of the energy beam is aligned with the center of the second upper surface of the first device, the energy beam is projected on a first region of the first device, with the first region having a first size; and at a second time the center of the energy beam is aligned to the position having the relatively low temperature, the energy beam is projected on a second region of the first device, with the second region having a second size equal to the first size.

6 . The method of claim 1 , wherein the energy beam comprises a laser beam.

7 . The method of claim 1 , wherein before the center of the energy beam is shifted from being substantially aligned with the center of the second upper surface of the first device, a first shot of the energy beam is performed.

8 . The method of claim 7 , wherein during the first shot, a size of the energy beam is constant.

9 . The method of claim 7 , wherein after the center of the energy beam is shifted from being substantially aligned to the position having the relatively low temperature, a second shot of the energy beam is performed.

10 . The method of claim 1 , wherein the first device comprises a device die, and the energy beam is projected onto a semiconductor substrate of the first device.

11 . A method comprising:
placing a device die on a package substrate; aligning a center of an energy beam to a first position of the device die; performing a first energy shot using the energy beam when the center of the energy beam is aligned to the first position; shifting the center of the energy beam to a second position of the device die; and performing a second energy shot using the energy beam when the center of the energy beam is aligned to the second position.

12 . The method of claim 11 , wherein during the first energy shot, a first solder region directly underlying a first area projected by the first energy shot is reflowed.

13 . The method of claim 12 , wherein during the second energy shot, a second solder region directly underlying a second area projected by the second energy shot is reflowed.

14 . The method of claim 12 , wherein at a time between the first energy shot and the second energy shot, the first solder region is solidified.

15 . The method of claim 14 , wherein during the second energy shot, the first solder region is further reflowed.

16 . The method of claim 11 , wherein the energy beam comprises a laser beam.

17 . A method comprising:
placing a device die on a package substrate; performing a first laser shot to a first part of the device die, wherein a first solder region between the device die and the package substrate is reflowed; shifting a laser beam used for the first laser shot to a second part of the device die having a lower temperature than the first part; and performing a second laser shot, wherein a second solder region between the device die and the package substrate is reflowed by the second laser shot, and wherein when the second solder region is reflowed, the first solder region remains solid.

18 . The method of claim 17 , wherein the first part of the device die comprises a center part of the device die, and the second part of the device die comprises an edge part of the device die.

19 . The method of claim 17 , wherein the first part of the device die comprises an edge part of the device die, and the second part of the device die comprises a center part of the device die.

20 . The method of claim 17 , wherein both of the first part and the second part of the device die comprise a semiconductor material.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Wei-Yu
• Cheng Chia-Shen
• Pei Hao-Jan
• Chung Philip Yu-Shuan
• Huang Kuei-Wei
• Tsai Yu-Peng
• Lin Hsiu-Jen
• Hsieh Ching-Hua
• Yu Chen-Hua
• Liu Chung-Shi

Classifications

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/07255

  changes in materials · CPC title

• H10W72/07235

  Applying EM radiation, e.g. induction heating or using a laser · CPC title

• H10W72/257

  Multiple bump connectors having different materials · CPC title