Bonding through multi-shot laser reflow

Patent metadata

Field	Value
Publication number	US-12040309-B2
Application number	US-202217815713-A
Country	US
Kind code	B2
Filing date	Jul 28, 2022
Priority date	Mar 12, 2018
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

First claim

What is claimed is:

1. A method comprising:
performing a first laser shot on a first package component, wherein the first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot;
after the first laser shot, allowing the first solder region to solidify; and
after the first solder region solidifies, performing a second laser shot on the first package component, wherein the first solder region is reflowed again by the second laser shot.

2. The method of claim 1 , wherein the first laser shot is performed on a first portion of the first package component, wherein the second laser shot is performed on a second portion of the first package component, and wherein the first portion and the second portion have an overlapped portion.

3. The method of claim 2 , wherein the first portion further comprises an additional portion outside of the overlapped portion.

4. The method of claim 2 , wherein:
the first portion of the first package component overlaps a first plurality of solder regions, and wherein the first plurality of solder regions are reflowed by the first laser shot; and
the second portion of the first package component overlaps a second plurality of solder regions, and wherein the second plurality of solder regions are reflowed by the second laser shot.

5. The method of claim 4 , wherein the first plurality of solder regions and the second plurality of solder regions comprise a row of common solder regions.

6. The method of claim 1 , wherein a second solder region between the first package component and the second package component is reflowed by the second laser shot, and wherein the method further comprises:
after the second laser shot, allowing the second solder region to solidify; and
after the second solder region has been solidified, performing a third laser shot on the first package component, wherein the second solder region is reflowed again by the third laser shot.

7. The method of claim 1 , wherein the first laser shot and the second laser shot in combination cover more than a half of the first package component.

8. A method comprising:
performing a first laser shot on a first portion of a top surface of a first package component, wherein the first package component is over a second package component, and a first solder region between the first package component and the second package component is molten by the first laser shot;
upon finishing the first laser shot, delaying a period of time; and
after the period of time, performing a second laser shot on a second portion of the top surface of the first package component to melt the first solder region again, wherein the first portion and the second portion partially overlap with each other.

9. The method of claim 8 , wherein a second solder region between the first package component and the second package component is further reflowed by the first laser shot, and wherein the second laser shot further covers a portion of the first package component that is vertically offset from the second solder region.

10. The method of claim 9 further comprising:
after the second solder region solidifies, performing a third laser shot on the top surface of the first package component to melt an additional solder region between the first package component and the second package component.

11. The method of claim 8 , wherein after the period of time, a temperature of the first solder region is dropped into a range between about 100° C. and about 150° C.

12. The method of claim 8 , wherein the delaying the period of time comprises delaying for 5 seconds to 10 seconds.

13. The method of claim 8 , wherein in the first laser shot, a laser beam is performed on the top surface of the first package component, and heat is transferred through the first package component to the first solder region.

14. The method of claim 8 , wherein each of the first laser shot and the second laser shot covers a rectangular region of the first package component, and wherein the rectangular regions of the first laser shot and the second laser shot comprise a same strip-shaped region of the first package component.

15. The method of claim 8 , wherein the first laser shot covers a portion of the top surface of the first package component, and a power of the first laser shot is distributed substantially uniformly in the portion of the top surface of the first package component.

16. A method comprising:
placing a first package component over a second package component;
performing a first laser shot on the first package component using a reflow apparatus comprising a laser beam generator, wherein a first laser beam of the first laser shot covers a first portion of the first package component, with a first solder region being directly underlying the first portion;
reconfiguring the reflow apparatus to allow the laser beam generator to be able to project a second laser beam on a second portion of the first package component; and
performing a second laser shot on the first package component using the reflow apparatus, wherein the second laser beam of the second laser shot covers the second portion of the first package component, with the first solder region being directly underlying the second portion, wherein the first package component and the second package component are on a conveyer belt when the first package component receives the first laser shot and the second laser shot, and wherein the reconfiguring comprises synchronizing movement of the conveyer belt with the first laser shot and the second laser shot.

17. The method of claim 16 , wherein:
the first laser shot further reflows a second solder region, with the second solder region un-reflowed by the second laser shot; and
the second laser shot further reflows a third solder region, with the third laser region un-reflowed by the first laser shot.

18. The method of claim 16 , wherein the reconfiguring comprises adjusting timing of the first laser shot and the second laser shot.

19. The method of claim 16 , wherein between the first laser shot and the second laser shot, a temperature of the first solder region is dropped into a temperature range between about 100° C. and about 150° C.

20. The method of claim 8 , wherein during the period of time, the first solder region is solidified.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Wei-Yu
• Cheng Chia-Shen
• Pei Hao-Jan
• Chung Philip Yu-Shuan
• Huang Kuei-Wei
• Tsai Yu-Peng
• Lin Hsiu-Jen
• Hsieh Ching-Hua
• Yu Chen-Hua
• Liu Chung-Shi

Classifications

• H10W72/07255

  changes in materials · CPC title

• H10W72/07235

  Applying EM radiation, e.g. induction heating or using a laser · CPC title

• H10W72/257

  Multiple bump connectors having different materials · CPC title

• H10W74/129

  forming a chip-scale package [CSP] · CPC title

• H10W74/01 Primary

  Manufacture or treatment · CPC title