Methods of forming semiconductor packages

Patent metadata

Field	Value
Publication number	US-12368149-B2
Application number	US-202418588986-A
Country	US
Kind code	B2
Filing date	Feb 27, 2024
Priority date	Mar 23, 2018
Publication date	Jul 22, 2025
Grant date	Jul 22, 2025

Abstract

In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

First claim

What is claimed is:

1. A method comprising:
bonding a first package component to a second package component, the first package component comprising first conductive connectors in a first package region and second conductive connectors in a second package region, the first package region adjacent the second package region, the bonding comprising:
projecting a laser beam at a first portion of the first package component until the first conductive connectors are molten, the first portion of the first package component overlapping each of the first conductive connectors and only a subset of the second conductive connectors; and
after projecting the laser beam at the first portion of the first package component, projecting the laser beam at a second portion of the first package component until the second conductive connectors are molten, the second portion of the first package component overlapping each of the second conductive connectors and only a subset of the first conductive connectors.

2. The method of claim 1 , wherein the subset of the second conductive connectors are heated but are not molten when projecting the laser beam at the first portion of the first package component, and the subset of the first conductive connectors are heated but are not molten when projecting the laser beam at the second portion of the first package component.

3. The method of claim 1 , wherein the first conductive connectors and the second conductive connectors are disposed at a front-side of the first package component.

4. The method of claim 3 , wherein the laser beam is projected at a back-side of the first package component, and heat generated by the laser beam is transferred through the first package component to the front-side of the first package component.

5. The method of claim 1 , further comprising:
after projecting the laser beam at the first portion of the first package component, turning off the laser beam for a first predetermined period of time, the first conductive connectors solidifying during the first predetermined period of time; and
after projecting the laser beam at the second portion of the first package component, turning off the laser beam for a second predetermined period of time, the second conductive connectors solidifying during the second predetermined period of time.

6. The method of claim 1 , further comprising:
after bonding the first package component to the second package component, singulating the first package region from the second package region.

7. The method of claim 1 , wherein the first portion and the second portion of the first package component overlap in a third region, the third region overlapping the subset of the first conductive connectors and the subset of the second conductive connectors.

8. A method comprising:
aligning first regions of a first package component with second regions of a second package component;
performing laser shots on the first package component with a laser beam, each respective laser shot of the laser shots being performed sequentially in a different respective first region of the first regions of the first package component, a conductive material between the respective first region and a respective second region of the second regions of the second package component being reflowed by the respective laser shot, wherein each respective laser shot is performed on a back-side of the first package component, and heat generated by the laser beam is transferred through the first package component to the conductive material; and
after performing the laser shots, singulating the first regions of the first package component and the second regions of the second package component.

9. The method of claim 8 , wherein the laser shots are performed sequentially in a back-and-forth sweep across the first regions of the first package component.

10. The method of claim 8 , wherein the laser shots are performed sequentially in different groups of the first regions of the first package component.

11. The method of claim 8 , wherein the laser shots are performed sequentially in a predetermined pattern of the first regions of the first package component.

12. The method of claim 8 , wherein each respective laser shot is performed by:
directing the laser beam at the respective first region until the conductive material is molten; and
after the conductive material is molten, turning off the laser beam until the conductive material cools.

13. The method of claim 8 , wherein each respective laser shot only partially overlaps others of the laser shots.

14. The method of claim 8 , wherein each respective laser shot is performed with the same unit power.

15. The method of claim 8 , wherein each respective laser shot is performed for the same period of time.

16. A method comprising:
placing a first package component on a second package component, the first package component comprising first conductive connectors in a first package region and second conductive connectors in a second package region, the first package region adjacent the second package region;
reflowing the first conductive connectors by performing a first laser shot at the first package region until the first conductive connectors are molten, the second conductive connectors not being molten; and
reflowing the second conductive connectors by performing a second laser shot at the second package region until the second conductive connectors are molten, the first conductive connectors not being molten.

17. The method of claim 16 , wherein the first laser shot and the second laser shot are performed at different heating conditions.

18. The method of claim 16 , wherein the first laser shot and the second laser shot are performed at the same heating condition.

19. The method of claim 16 , further comprising:
after reflowing the first conductive connectors, waiting until the first conductive connectors solidify before reflowing the second conductive connectors.

20. The method of claim 16 , wherein the first conductive connectors and the second conductive connectors are disposed at a front-side of the first package component, and the first laser shot and the second laser shot are performed at a back-side of the first package component.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Pei Hao-Jan
• Lin Hsiu-Jen
• Chen Wei-Yu
• Chung Philip Yu-Shuan
• Cheng Chia-Shen
• Huang Kuei-Wei
• Hsieh Ching-Hua
• Liu Chung-Shi
• Yu Chen-Hua

Classifications

• H10W90/722

  between stacked chips · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W72/9413

  on encapsulations · CPC title