Package assembly and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2025147245-A1
Application number	US-202318503189-A
Country	US
Kind code	A1
Filing date	Nov 7, 2023
Priority date	Nov 7, 2023
Publication date	May 8, 2025
Grant date	—

Abstract

A package assembly and a manufacturing method thereof are provided. The package assembly includes a photonic integrated circuit component, an electric integrated circuit component, a lens and an optical signal port. The photonic integrated circuit component comprises an optical input/output portion configured to transmit and receive optical signal. The electric integrated circuit component is electrically connected to the photonic integrated circuit component. The lens is disposed on a sidewall of the photonic integrated circuit component. The optical signal port is optically coupled to the optical input/output portion.

First claim

What is claimed is:

1 . A package assembly, comprising:
a photonic integrated circuit component comprising an optical input/output portion configured to transmit and receive optical signal; an electric integrated circuit component, electrically connected to the photonic integrated circuit component; a lens disposed on a sidewall of the photonic integrated circuit component; and an optical signal port optically coupled to the optical input/output portion.

2 . The package assembly as claimed in claim 1 , wherein the lens is directly in contact with the sidewall of the photonic integrated circuit component, and aligned with the optical input/output portion.

3 . The package assembly as claimed in claim 1 , wherein the lens is disposed on the sidewall of the photonic integrated circuit component via an adhesive layer, and aligned with the optical input/output portion.

4 . The package assembly as claimed in claim 1 , wherein the optical signal port comprises a fiber laterally aligned with the lens and the optical input/output portion.

5 . The package assembly as claimed in claim 4 , wherein the fiber is optically coupled to the optical input/output portion through the lens.

6 . The package assembly as claimed in claim 1 , wherein the optical signal port comprises:
an optical component with a reflective surface facing downwardly toward the lens; and a fiber aligned with the reflective surface of the optical component.

7 . The package assembly as claimed in claim 6 , wherein the fiber is optically coupled to the optical input/output portion through the lens and the optical component.

8 . A package assembly, comprising:
an optical engine comprising:
a photonic integrated circuit component comprising an optical input/output portion configured to transmit and receive optical signal;
an electric integrated circuit component, electrically connected to the photonic integrated circuit component;
an insulating encapsulant encapsulating the electric integrated circuit component; and
a support layer disposed on the electric integrated circuit component and the insulating encapsulant;
a lens secured on a sidewall of the photonic integrated circuit component; and an optical signal port connected with the optical engine and optically coupled to the optical input/output portion through the lens.

9 . The package assembly as claimed in claim 8 , wherein the sidewall of the photonic integrated circuit component is substantially leveled with a sidewall of the insulating encapsulant.

10 . The package assembly as claimed in claim 8 , wherein the lens is directly in contact with the sidewall of the photonic integrated circuit component.

11 . The package assembly as claimed in claim 8 , wherein the lens is attached on the sidewall of the photonic integrated circuit component via an adhesive layer.

12 . The package assembly as claimed in claim 8 , further comprising a socket attached on the support layer.

13 . The package assembly as claimed in claim 12 , wherein the optical signal port is connected with the optical engine via the socket.

14 . The package assembly as claimed in claim 13 , further comprising a connection component connected between the optical signal port and the socket.

15 . The package assembly as claimed in claim 8 , wherein the optical signal port comprises a fiber facing the sidewall of the photonic integrated circuit component.

16 . The package assembly as claimed in claim 8 , wherein the optical signal port comprises:
an optical component with a reflective surface facing downwardly toward the lens; and a fiber facing the reflective surface of the optical component.

17 . A manufacturing method of a package assembly, comprising:
providing an optical engine comprising:
a photonic integrated circuit component comprising an optical input/output portion configured to transmit and receive optical signal;
an electric integrated circuit component, electrically connected to the photonic integrated circuit component;
an insulating encapsulant laterally surrounded the electric integrated circuit component; and
a support layer disposed on the electric integrated circuit component and the insulating encapsulant;
securing a lens on a sidewall of the photonic integrated circuit component; and attaching an optical signal port onto the optical engine.

18 . The manufacturing method as claimed in claim 17 , wherein the step of securing a lens on a sidewall of the photonic integrated circuit component comprising forming the lens on the sidewall of the photonic integrated circuit component by a 3D printing process.

19 . The manufacturing method as claimed in claim 17 , wherein the step of securing a lens on a sidewall of the photonic integrated circuit component comprising:
forming the lens by a 3D printing process; and attaching the lens on the sidewall of the photonic integrated circuit component via an adhesive layer.

20 . The manufacturing method as claimed in claim 17 , further comprising:
using the optical signal port to check an alignment between the lens and the optical input/output portion.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Lin Wen-Chih
• Kuo Hsuan-Ting
• Kuo Cheng-Yu
• Chen Yen-Hung
• Cheng Chia-Shen
• Li Chao-Wei
• Hsieh Ching-Hua
• Chiou Wen-Chih

Classifications

• H10W90/792

  between multiple chips · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• G02B6/4214 Primary

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

• H01L2224/16145

  Electricity · mapped topic