Workpiece holder, wafer chuck, wafer holding method

Patent metadata

Field	Value
Publication number	US-2025201621-A1
Application number	US-202519067975-A
Country	US
Kind code	A1
Filing date	Mar 2, 2025
Priority date	Jan 19, 2020
Publication date	Jun 19, 2025
Grant date	—

Abstract

A workpiece holder includes a chuck body and a seal ring. The chuck body includes a receiving surface configured to receive a workpiece and at least one vacuum port configured to apply a vacuum seal. The seal ring surrounds a side surface of the chuck body. A top surface of the seal ring is higher than the receiving surface of the chuck body, and the workpiece leans against the seal ring when the vacuum seal is applied between the workpiece and the chuck body.

First claim

What is claimed is:

1 . A workpiece holder, comprising:
a chuck body comprising a receiving surface configured to receive a workpiece and at least one vacuum port configured to apply a vacuum seal, wherein the workpiece comprises a tape carrier extending beyond the periphery of the chuck body, a workpiece body disposed on the tape carrier; and a seal ring disposed on an outermost lateral surface of the chuck body, wherein a top surface of the seal ring is higher than the receiving surface of the chuck body, and the tape carrier leans against the seal ring when a vacuum seal is applied between the tape carrier and the chuck body; and a supporter disposed at the outermost lateral surface of the chuck body and comprising a groove, wherein at least a part of the sealing ring is disposed within the groove.

2 . The workpiece holder as claimed in claim 1 , wherein a vertical distance between the top surface of the seal ring and the receiving surface substantially ranges from 1.5 mm to 3.5 mm.

3 . The workpiece holder as claimed in claim 1 , wherein the workpiece body is disposed within a region surrounded by the seal ring, and the tape carrier extended beyond the region.

4 . The workpiece holder as claimed in claim 3 , wherein the workpiece body comprises a semiconductor device and an encapsulating material at least laterally encapsulating the semiconductor device.

5 . The workpiece holder as claimed in claim 3 , wherein a vertical distance from an outer edge of the workpiece body to the receiving surface is 1.5 to 5 times as long as a vertical distance from an outer edge of the receiving surface to the tape carrier.

6 . The workpiece holder as claimed in claim 1 , further comprising a clamping element disposed at a side of the chuck body, wherein the workpiece leans against the seal ring when clamped by the clamping element.

7 . The workpiece holder as claimed in claim 1 , wherein the supporter further comprises a plurality of fasten elements extending through the supporter to lock the supporter to the chuck body.

8 . The workpiece holder as claimed in claim 1 , wherein the workpiece, the seal ring and the chuck body together form an enclosed space for the vacuum seal to be applied thereto.

9 . A wafer chuck, comprising:
a chuck body comprising a receiving surface configured to receive a wafer; and a seal ring disposed on and surrounding an outermost lateral surface of the chuck body, wherein a top surface of the seal ring is higher than the receiving surface of the chuck body, and the sealing ring is apart from an outer edge of the wafer from a top view; and a clamping element disposed at a side of the chuck body and clamping a tape carrier where the wafer disposed.

10 . The wafer chuck as claimed in claim 9 , wherein the top surface of the seal ring does not overlap the receiving surface of the chuck body from a top view.

11 . The wafer chuck as claimed in claim 9 , wherein the wafer is attached to the tape carrier, which extends beyond the periphery of the chuck body and leans against the seal ring.

12 . The wafer chuck as claimed in claim 11 , wherein the tape carrier leans against the seal ring when clamped by the clamping element.

13 . The wafer chuck as claimed in claim 11 , wherein the tape carrier comprises a tape portion and a frame portion disposed at a periphery of the tape portion, and the tape portion leans against the seal ring when the frame portion is clamped by the clamping element.

14 . The wafer chuck as claimed in claim 1 , further comprising a supporter disposed at the outermost lateral surface and comprising a stepped groove for holding the seal ring.

15 . A method of manufacturing a semiconductor package, comprising:
providing a semiconductor device on a substrate; providing an encapsulating material over the substrate to at least laterally encapsulate the semiconductor device and form a reconstructed wafer; attaching the reconstructed wafer to a tape carrier; debonding the substrate from the reconstructed wafer; providing the reconstructed wafer with the tape carrier on a wafer chuck, wherein the wafer chuck comprises a chuck body and a seal ring surrounding an outermost lateral surface of the chuck body; fixing the tape carrier outside the chuck body, wherein the tape carrier leans against the seal ring and an enclosed space is formed between the chuck body, the tape carrier and the seal ring; forming a vacuum seal by evacuating gas from the enclosed space to pull the periphery of the reconstructed wafer toward the chuck body; and processing the reconstructed wafer on the wafer chuck.

16 . The wafer holding method as claimed in claim 15 , wherein the vacuum seal is applied by a vacuum port on the receiving surface after the tape carrier is fixed outside the chuck body.

17 . The wafer holding method as claimed in claim 15 , wherein fixing the tape carrier outside the chuck body comprises clamping the tape carrier by a clamp element disposed at a side of the chuck body.

18 . The wafer holding method as claimed in claim 15 , wherein fixing the tape carrier comprises clamping a frame portion of the tape carrier while a tape portion of the tape carrier leans against the seal ring.

19 . The wafer holding method as claimed in claim 15 , wherein, when the enclosed space is formed between the chuck body, the tape carrier and the seal ring, a vertical distance from an outer edge of the reconstructed wafer to the receiving surface of the chuck body is 1.5 to 5 times as long as a vertical distance from an outer edge of the receiving surface of the chuck body to the tape carrier.

20 . The wafer holding method as claimed in claim 15 , wherein processing the reconstructed wafer on the wafer chuck comprises laser drilling process performed on an insulation layer of the reconstructed wafer, solder paste printing, or singulation process.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Wong Cheng-Shiuan
• Tsao Chih-Chiang
• Chiu Chao-Wei
• Pei Hao-Jan
• Chen Wei-Yu
• Lin Hsiu-Jen
• Hsieh Ching-Hua
• Cheng Chia-Shen

Classifications

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W70/09

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title