Manufacturing method of a semiconductor device
US-2024379382-A1 · Nov 14, 2024 · US
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Chen Vincent patents
Chen Vincent is listed as an inventor on 39 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Vincent |
| Total patents | 39 |
| First publication | Mar 2, 2017 |
| Latest publication | Nov 14, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Manufacturing method of a semiconductor device
US-12046480-B2 · Jul 23, 2024 · US
Packaged semiconductor devices and packaging methods
US-11211358-B2 · Dec 28, 2021 · US
Semiconductor device
US-11211339-B2 · Dec 28, 2021 · US
Semiconductor structure
US-11004811-B2 · May 11, 2021 · US
Semiconductor structure
US-2020388584-A1 · Dec 10, 2020 · US
Manufacturing method of a semiconductor device
US-2020357659-A1 · Nov 12, 2020 · US
Semiconductor structure
US-10763229-B2 · Sep 1, 2020 · US
Semiconductor device and manufacturing method thereof
US-10727082-B2 · Jul 28, 2020 · US
Packaged Semiconductor Devices and Packaging Methods
US-2020118971-A1 · Apr 16, 2020 · US
Recent patents
Latest publications not already listed above.
Semiconductor device
US-2020111753-A1 · Apr 9, 2020 · US
Semiconductor structure
US-2020075516-A1 · Mar 5, 2020 · US
Packaged semiconductor devices and packaging methods
US-10510714-B2 · Dec 17, 2019 · US
Semiconductor device
US-10510681-B2 · Dec 17, 2019 · US
Semiconductor package devices integrated with inductor
US-10510660-B2 · Dec 17, 2019 · US
Semiconductor structure
US-10475755-B2 · Nov 12, 2019 · US
Semiconductor structure
US-2019067222-A1 · Feb 28, 2019 · US
Semiconductor package devices integrated with inductor
US-2018350740-A1 · Dec 6, 2018 · US
Semiconductor device
US-2018350752-A1 · Dec 6, 2018 · US
Packaged Semiconductor Devices and Packaging Methods
US-2018350771-A1 · Dec 6, 2018 · US
Fan-out package structure, antenna system and associated method
US-10128203-B2 · Nov 13, 2018 · US
Method of manufacturing a semiconductor structure
US-10115685-B2 · Oct 30, 2018 · US
InFO coil on metal plate with slot
US-10074472-B2 · Sep 11, 2018 · US
Packaged semiconductor devices and packaging methods
US-10050013-B2 · Aug 14, 2018 · US
Method of manufacturing a semiconductor structure
US-2018226368-A1 · Aug 9, 2018 · US
Semiconductor package devices integrated with inductor
US-10043745-B2 · Aug 7, 2018 · US
Semiconductor device and manufacturing method thereof
US-10043761-B2 · Aug 7, 2018 · US
Semiconductor structure and manufacturing method thereof
US-9953936-B2 · Apr 24, 2018 · US
Semiconductor package devices integrated with inductor
US-2017287832-A1 · Oct 5, 2017 · US
Fan-out package structure, antenna system and associated method
US-2017221838-A1 · Aug 3, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 39 |
| Taiwwan Semiconductor Mfg Company Ltd | 1 |
| Taiwan Semiconductor Mfg Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/60 | 28 |
| H10W42/20 | 21 |
| H10W72/9413 | 21 |
| H10W44/20 | 20 |
| H10W70/09 | 19 |