InFO coil on metal plate with slot

Patent metadata

Field	Value
Publication number	US-10074472-B2
Application number	US-201615061419-A
Country	US
Kind code	B2
Filing date	Mar 4, 2016
Priority date	Dec 15, 2015
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

A structure includes an encapsulating material, and a coil including a through-conductor. The through-conductor is in the encapsulating material, with a top surface of the through-conductor coplanar with a top surface of the encapsulating material, and a bottom surface of the through-conductor coplanar with a bottom surface of the encapsulating material. A metal plate is underlying the encapsulating material. A slot is in the metal plate and filled with a dielectric material. The slot has a portion overlapped by the coil.

First claim

What is claimed is:

1. A structure comprising:
an encapsulating material;
a coil comprising a through-conductor, wherein the through-conductor is in the encapsulating material, with a top surface of the through-conductor substantially coplanar with a top surface of the encapsulating material, and a bottom surface of the through-conductor substantially coplanar with a bottom surface of the encapsulating material;
a metal plate underlying the encapsulating material; and
a first slot in the metal plate and filled with a dielectric material, wherein the first slot has a portion overlapped by the coil, wherein the first slot has a length greater than a respective length of the coil, and a width smaller than a respective width of the coil.

2. The structure of claim 1 , wherein the encapsulating material is a dielectric material.

3. The structure of claim 1 , wherein the first slot extends to an edge of the metal plate.

4. The structure of claim 1 , wherein the first slot is an air gap, and the structure further comprises a dielectric film sealing the first slot, with the dielectric film being on an opposite side of the metal plate than the encapsulating material.

5. The structure of claim 1 further comprising a second slot perpendicular to, and intersecting, the first slot, wherein the second slot does not extend beyond edges of the coil.

6. The structure of claim 1 , wherein the first slot comprises:
a bulk portion fully overlapped by the coil; and
an elongated portion connected to the bulk portion, wherein the elongated portion has a width smaller than a respective width of the coil and a respective width of the bulk portion, and the elongate portion extends beyond a respective edge of the coil.

7. A structure comprising:
an encapsulating material;
a device die encapsulated in the encapsulating material;
through-conductors encapsulated in the encapsulating material, wherein the through-conductors form parts of a coil electrically coupled to the device die;
a metal plate with a portion overlapped by the coil, wherein the metal plate extends beyond edges of the coil; and
a dielectric material penetrating through the metal plate, wherein the dielectric material comprises:
a first elongated portion having a first lengthwise direction parallel to a first direction, wherein the first elongated portion comprises:
a first portion overlapped by the coil; and
a second portion un-overlapped by the coil; and

a second elongated portion having a second lengthwise direction parallel to a second direction, with the second direction unparallel to the first direction, wherein the second elongated portion is joined to the first elongated portion, and is overlapped by the coil.

8. The structure of claim 7 , wherein the first elongated portion extends to a first edge of the metal plate.

9. The structure of claim 8 , wherein the first elongated portion further extends to a second edge of the metal plate, with the first edge and the second edge being opposite edges of the metal plate.

10. The structure of claim 7 , wherein the first elongated portion has a width measured in the second direction, and the width of the first elongated portion is smaller than a respective dimension of the coil measured in the second direction.

11. The structure of claim 7 , wherein the second elongated portion has a length measured in the second direction, wherein the length of the second elongated portion is smaller than a respective dimension of the coil measured in the second direction.

12. The structure of claim 11 , wherein the second elongated portion has a width measured in the first direction, and the width of the second elongated portion is smaller than a respective dimension of the coil measured in the first direction.

13. The structure of claim 7 , wherein an entirety of an intersection area of the first elongated portion and the second elongated portion is overlapped by the coil.

14. A structure comprising:
an encapsulating material;
a device die encapsulated in the encapsulating material;
through-conductors encapsulated in the encapsulating material, wherein the through-conductors form parts of a coil electrically coupled to the device die;
a metal plate with a portion overlapped by the coil, wherein the metal plate extends beyond edges of the coil; and
a dielectric region penetrating through the metal plate, wherein the dielectric region comprises:
a bulk portion overlapped by the coil; and
an elongated portion connected to the bulk portion, wherein the elongate portion is narrower than the bulk portion, and the elongate portion comprises a first portion overlapped by the coil, and a second portion extending beyond an edge of the coil.

15. The structure of claim 14 , wherein an entirety of the bulk portion is overlapped by the coil.

16. The structure of claim 14 , wherein the elongate portion extends to an edge of the metal plate.

17. The structure of claim 14 , wherein the dielectric region comprises an air gap.

18. The structure of claim 14 , wherein the through-conductors comprise:
top ends substantially coplanar with both a top surface of the encapsulating material and a top surface of the device die; and
bottom ends substantially coplanar with a bottom surface of the encapsulating material.

19. The structure of claim 14 further comprising an adhesive attaching the metal plate to the encapsulating material.

20. The structure of claim 2 , wherein the encapsulating material comprises a molding compound.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Wang Chuei-Tang
• Chen Wei-Ting
• Chen Vincent
• Tsai Hao-Yi
• Tseng Ming Hung
• Kuo Hung-Yi
• Yu Chen-Hua

Classifications

• H10W44/501 Primary

  Inductive arrangements (H10W44/20 takes precedence) · CPC title

• H01F38/14

  Inductive couplings {(for wireless supply or distribution of electric power using inductive coupling H02J50/10)} · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F2027/2809

  on stacked layers · CPC title