Semiconductor package structure, semiconductor wafer level package and semiconductor manufacturing process
US-10658257-B1 · May 19, 2020 · US
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Chen Dao-Long patents
Chen Dao-Long is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Dao-Long |
| Total patents | 21 |
| First publication | Jul 21, 2016 |
| Latest publication | May 19, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor devices and semiconductor packages
US-10658319-B2 · May 19, 2020 · US
Semiconductor package structure, semiconductor wafer level package and semiconductor manufacturing process
US-2020144143-A1 · May 7, 2020 · US
Substrate and semiconductor device package
US-10553527-B2 · Feb 4, 2020 · US
Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packages
US-2019214323-A1 · Jul 11, 2019 · US
Semiconductor devices and semiconductor packages
US-2019148326-A1 · May 16, 2019 · US
Substrate and semiconductor device package
US-2019080993-A1 · Mar 14, 2019 · US
Semiconductor device package having an underfill barrier
US-10217649-B2 · Feb 26, 2019 · US
Semiconductor devices and semiconductor packages
US-10181448-B2 · Jan 15, 2019 · US
Semiconductor device package having an underfill barrier
US-2018358238-A1 · Dec 13, 2018 · US
Recent patents
Latest publications not already listed above.
Semiconductor device package and method of manufacturing the same
US-10037974-B2 · Jul 31, 2018 · US
Semiconductor package structure and method for manufacturing the same
US-2018114762-A1 · Apr 26, 2018 · US
Semiconductor package structure and method for manufacturing the same
US-9953930-B1 · Apr 24, 2018 · US
Semiconductor packages
US-9917071-B1 · Mar 13, 2018 · US
Semiconductor devices and semiconductor packages
US-2017278814-A1 · Sep 28, 2017 · US
Semiconductor device package and method of manufacturing the same
US-2017263589-A1 · Sep 14, 2017 · US
Bump structures, semiconductor device and semiconductor device package having the same
US-9741675-B2 · Aug 22, 2017 · US
Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packages
US-2017141007-A1 · May 18, 2017 · US
Semiconductor package structure and method for manufacturing the same
US-9589871-B2 · Mar 7, 2017 · US
Semiconductor package structure and method for manufacturing the same
US-2016300782-A1 · Oct 13, 2016 · US
Bump structures, semiconductor device and semiconductor device package having the same
US-2016211235-A1 · Jul 21, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Advanced Semiconductor Eng | 21 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 14 |
| H10W72/252 | 13 |
| H10W90/734 | 12 |
| H10W72/072 | 11 |
| H10W72/222 | 10 |