Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packages

Patent metadata

Field	Value
Publication number	US-2017141007-A1
Application number	US-201514943519-A
Country	US
Kind code	A1
Filing date	Nov 17, 2015
Priority date	Nov 17, 2015
Publication date	May 18, 2017
Grant date	—

Abstract

The present disclosure relates to a filler composition for a semiconductor package. The filler composition comprises carbon and silica.

First claim

1 . A filler composition for a semiconductor package, comprising carbon and silica.

2 . The filler composition according to claim 1 , wherein an amount of carbon in the filler composition is at least 5% by weight of the filler composition.

3 . The filler composition according to claim 1 , wherein an amount of carbon in the filler composition is in a range of 30% to 85% by weight of the filler composition.

4 . The filler composition according to claim 1 , wherein an amount of silica in the filler composition is at least 5% by weight of the filler composition and up to 95% by weight of the filler composition.

5 . The filler composition according to claim 1 , wherein a ratio of amounts of carbon to silica, by weight, in the filler composition is at least 0.05.

6 . The filler composition according to claim 1 , wherein the filler composition includes particles having a median size, by weight, in a range of 0.1 μm to 50 μm.

7 . An underfill composition for a semiconductor package, comprising:
a base material; and the filler composition according to claim 1 .

8 . The underfill composition according to claim 7 , wherein the base material includes an epoxy component.

9 . The underfill composition according to claim 7 , further comprising a silane coupling agent.

10 . The underfill composition according to claim 9 , wherein the silane coupling agent is selected from 3-aminopropyltriethoxysilane and 3-glycidoxypropyltriethoxysilane.

11 . A molding compound for a semiconductor package, comprising:
a base material; and the filler composition according to claim 1 .

12 . The molding compound according to claim 11 , further comprising a silane coupling agent.

13 . An adhesive for a semiconductor package, comprising:
a base material; and the filler composition according to claim 1 .

14 . The adhesive according to claim 13 , further comprising a silane coupling agent.

15 . A process for preparing a filler composition for a semiconductor package, comprising:
(a) combining phytoliths and a solvent to form a dispersion; (b) modifying a pH value of the dispersion to form an acidic dispersion; (c) carrying out a heat treatment on the acidic dispersion; and (d) calcining at least a portion of the acidic dispersion in a reducing environment to form the filler composition.

16 . The process according to claim 15 , wherein the phytoliths are selected from husks, rice straws, and mixtures thereof.

17 . The process according to claim 15 , wherein carrying out the heat treatment in (c) includes applying a hydrothermal process at a temperature in a range of 50° C. to 200° C.

18 . The process according to claim 15 , wherein calcining in (d) is carried out at a temperature in a range of 600° C. to 1000° C.

19 . The process according to claim 15 , wherein calcining in (d) is carried out in a nitrogen environment.

20 . The process according to claim 15 , further comprising applying microwave irradiation to the filler composition.

Assignees

• Advanced Semiconductor Eng

Inventors

• Hsieh Ya-Yu
• Lin Hong-Ping
• Chen Dao-Long
• Yang Ping-Feng
• Shih Meng-Kai

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title