Inter-wire cavity for low capacitance
US-12550721-B2 · Feb 10, 2026 · US
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Chen Chii-Ping patents
Chen Chii-Ping is listed as an inventor on 77 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Chii-Ping |
| Total patents | 77 |
| First publication | Feb 12, 2015 |
| Latest publication | Feb 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor devices and method for forming the same
US-12543566-B2 · Feb 3, 2026 · US
Forming interconnect structures in semiconductor devices
US-12512363-B2 · Dec 30, 2025 · US
Self-aligned scheme for semiconductor device and method of forming the same
US-2025364328-A1 · Nov 27, 2025 · US
Self-aligned scheme for semiconductor device and method of forming the same
US-12476146-B2 · Nov 18, 2025 · US
Thermal dissipation in semiconductor devices
US-2025343095-A1 · Nov 6, 2025 · US
Self-aligned scheme for semiconductor device and method of forming the same
US-2025329584-A1 · Oct 23, 2025 · US
Thermal dissipation in semiconductor devices
US-12451401-B2 · Oct 21, 2025 · US
Semiconductor device structure with barrier layer
US-2025323164-A1 · Oct 16, 2025 · US
Inter-wire cavity for low capacitance
US-2025316531-A1 · Oct 9, 2025 · US
Recent patents
Latest publications not already listed above.
Barrier free interface between beol interconnects
US-2025300011-A1 · Sep 25, 2025 · US
Self-aligned scheme for semiconductor device and method of forming the same
US-12387977-B2 · Aug 12, 2025 · US
Diffusion barrier layer for conductive via to decrease contact resistance
US-12368103-B2 · Jul 22, 2025 · US
Barrier free interface between BEOL interconnects
US-12362235-B2 · Jul 15, 2025 · US
Method for forming a semiconductor structure by diffusing manganese from a seed layer to a barrier layer
US-12341101-B2 · Jun 24, 2025 · US
Semiconductor devices and method for forming the same
US-12165947-B2 · Dec 10, 2024 · US
Diffusion barrier layer for conductive via to decrease contact resistance
US-2024404953-A1 · Dec 5, 2024 · US
Self-aligned interconnect structure and method of forming the same
US-2024379436-A1 · Nov 14, 2024 · US
Semiconductor device structure with resistive element
US-12119262-B2 · Oct 15, 2024 · US
Conductive structure in semiconductor structure and method for forming the same
US-2024266279-A1 · Aug 8, 2024 · US
Method for manufacturing semiconductor structure with resistive elements
US-12040178-B2 · Jul 16, 2024 · US
Thermal dissipation in semiconductor devices
US-2024194559-A1 · Jun 13, 2024 · US
Thermal dissipation in semiconductor devices
US-11942390-B2 · Mar 26, 2024 · US
Self-aligned scheme for semiconductor device and method of forming the same
US-11901228-B2 · Feb 13, 2024 · US
Semiconductor device structure with resistive element
US-11901289-B2 · Feb 13, 2024 · US
Semiconductor devices and method for forming the same
US-2024021494-A1 · Jan 18, 2024 · US
Self-aligned scheme for semiconductor device and method of forming the same
US-2023411210-A1 · Dec 21, 2023 · US
Self-aligned scheme for semiconductor device and method of forming the same
US-11830770-B2 · Nov 28, 2023 · US
Self-aligned scheme for semiconductor device and method of forming the same
US-2023377966-A1 · Nov 23, 2023 · US
Semiconductor device structure with barrier layer and method for forming the same
US-2023369226-A1 · Nov 16, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 74 |
| Taiwan Semiconductor Mfg | 5 |
| Chen Chii-Ping | 3 |
| Chen Dian-Hau | 2 |
| Tsai Hsin-Yi | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/42 | 44 |
| H10W20/077 | 34 |
| H10W20/056 | 33 |
| H01L23/5226 | 32 |
| H10W20/425 | 30 |