Generating a MEMS device with glass cover and MEMS device
US-12534360-B2 · Jan 27, 2026 · US
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Brockmeier Andre patents
Brockmeier Andre is listed as an inventor on 68 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Brockmeier Andre |
| Total patents | 68 |
| First publication | Jun 25, 2015 |
| Latest publication | Jan 27, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Mems sensor with particle filter and method for producing it
US-2025376370-A1 · Dec 11, 2025 · US
MEMS sensor with particle filter and method for producing it
US-12415719-B2 · Sep 16, 2025 · US
3D dome wafer-level package for optical mems mirror with reduced footprint
US-12372780-B2 · Jul 29, 2025 · US
Sandwich structures for microelectromechanical system micro-mirrors
US-2025091858-A1 · Mar 20, 2025 · US
Method with mechanical dicing process for producing MEMS components
US-12060266-B2 · Aug 13, 2024 · US
Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures
US-11990520-B2 · May 21, 2024 · US
Method with stealth dicing process for fabricating MEMS semiconductor chips
US-11939216-B2 · Mar 26, 2024 · US
Method for processing a layer structure and microelectromechanical component
US-11787686-B2 · Oct 17, 2023 · US
3d dome wafer-level package for optical mems mirror with reduced footprint
US-2023288695-A1 · Sep 14, 2023 · US
Recent patents
Latest publications not already listed above.
Carrier, laminate and method of manufacturing semiconductor devices
US-11576259-B2 · Feb 7, 2023 · US
Vertical power semiconductor device, semiconductor wafer or bare-die arrangement, carrier, and method of manufacturing a vertical power semiconductor device
US-11502190-B2 · Nov 15, 2022 · US
Method for forming semiconductor devices using a glass structure attached to a wide band-gap semiconductor wafer
US-2022293558-A1 · Sep 15, 2022 · US
Semiconductor package devices and method for forming semiconductor package devices
US-11393784-B2 · Jul 19, 2022 · US
Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures
US-2022085174-A1 · Mar 17, 2022 · US
Mems sensor with particle filter and method for producing it
US-2022033249-A1 · Feb 3, 2022 · US
Semiconductor device and method of manufacturing a semiconductor device
US-11211459-B2 · Dec 28, 2021 · US
Method for Processing a Layer Structure and Microelectromechanical Component
US-2021363002-A1 · Nov 25, 2021 · US
Method for processing a layer structure and microelectromechanical component
US-11180362-B2 · Nov 23, 2021 · US
Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces
US-11148943-B2 · Oct 19, 2021 · US
Method with stealth dicing process for fabricating mems semiconductor chips
US-2021309513-A1 · Oct 7, 2021 · US
Method with mechanical dicing process for producing mems components
US-2021253421-A1 · Aug 19, 2021 · US
Method for processing a monocrystalline substrate and micromechanical structure
US-11046577-B2 · Jun 29, 2021 · US
Vertical Power Semiconductor Device, Semiconductor Wafer or Bare-Die Arrangement, Carrier, and Method of Manufacturing a Vertical Power Semiconductor Device
US-2021167195-A1 · Jun 3, 2021 · US
Generating a mems device with glass cover and mems device
US-2020385264-A1 · Dec 10, 2020 · US
Method for processing a layer structure and microelectromechanical component
US-10766766-B2 · Sep 8, 2020 · US
Method for Processing a Layer Structure and Microelectromechanical Component
US-2020277183-A1 · Sep 3, 2020 · US
Semiconductor device with plated lead frame
US-10748787-B2 · Aug 18, 2020 · US
Method for processing a monocrystalline substrate and micromechanical structure
US-2020198963-A1 · Jun 25, 2020 · US
Semiconductor Device and Method of Manufacturing a Semiconductor Device
US-2020194558-A1 · Jun 18, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 64 |
| Infineon Technologies Austria Ag | 3 |
| Breymesser Alexander | 2 |
| Brockmeier Andre | 2 |
| Von Koblinski Carsten | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P54/00 | 20 |
| H01L21/78 | 17 |
| B81B7/02 | 15 |
| H10D62/8325 | 12 |
| H10D12/441 | 12 |