3D dome wafer-level package for optical mems mirror with reduced footprint

Patent metadata

Field	Value
Publication number	US-12372780-B2
Application number	US-202217690158-A
Country	US
Kind code	B2
Filing date	Mar 9, 2022
Priority date	Mar 9, 2022
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

A microelectromechanical systems (MEMS) mirror package assembly includes: a MEMS wafer including a stator portion and a rotor portion that includes a MEMS mirror configured to rotate about an axis, wherein the MEMS mirror is suspended over a back cavity, wherein the MEMS wafer defines a first portion of the back cavity; a spacer wafer, wherein the backside of the spacer wafer is bonded to the frontside of the MEMS wafer, wherein the spacer wafer defines a first portion of a front cavity arranged over the MEMS mirror; a transparent cover wafer, wherein the backside of the transparent cover wafer is bonded to the frontside of the spacer wafer, wherein the transparent cover wafer includes a transparent dome structure arranged over the MEMS mirror and defining a second portion of the front cavity. The center of the MEMS mirror is arranged substantially at a vertex of the transparent dome structure.

First claim

What is claimed is:

1. A microelectromechanical systems (MEMS) mirror package assembly, comprising:
a MEMS wafer comprising a stator portion that is rotationally fixed and a rotor portion that includes a MEMS mirror configured to rotate about at least one axis, wherein the MEMS mirror is suspended from the stator portion over a back cavity, the MEMS wafer comprising a frontside and a backside, wherein the MEMS wafer defines a first portion of the back cavity;
a spacer wafer comprising a frontside and a backside, wherein the backside of the spacer wafer is bonded to the frontside of the MEMS wafer, wherein the spacer wafer defines a first portion of a front cavity arranged over the MEMS mirror; and
a transparent cover wafer comprising a frontside and a backside, wherein the backside of the transparent cover wafer is bonded to the frontside of the spacer wafer, wherein the transparent cover wafer comprises a transparent dome structure arranged over the MEMS mirror and defining a second portion of the front cavity,
wherein a center of the MEMS mirror is arranged substantially at a vertex of the transparent dome structure, and
wherein the MEMS wafer includes one or more back cavity recesses, that define the first portion of the back cavity, through which the MEMS mirror moves during movement.

2. The MEMS mirror package assembly of claim 1 , further comprising:
a cavity wafer bonded to the backside of the MEMS wafer, wherein the cavity wafer includes a back cavity recess that defines a second portion of the back cavity,
wherein the cavity wafer, the spacer wafer, the MEMS wafer, and the transparent cover wafer form an enclosed volume around the MEMS mirror, wherein the enclosed volume comprises the front cavity and the back cavity.

3. The MEMS mirror package assembly of claim 2 , wherein the enclosed volume is a hermetically sealed volume.

4. The MEMS mirror package assembly of claim 2 , wherein the enclosed volume has a vacuum pressure or a low pressure.

5. The MEMS mirror package assembly of claim 2 , wherein the backside of the spacer wafer is hermetically bonded to the frontside of the MEMS wafer, the backside of the transparent cover wafer is hermetically bonded to the frontside of the spacer wafer, and the cavity wafer is hermetically bonded to the backside of the MEMS wafer.

6. The MEMS mirror package assembly of claim 1 , wherein the backside of the spacer wafer is hermetically bonded to the frontside of the MEMS wafer, and the backside of the transparent cover wafer is hermetically bonded to the frontside of the spacer wafer.

7. The MEMS mirror package assembly of claim 1 , wherein the MEMS mirror is part of a one-piece integral member of the MEMS wafer.

8. The MEMS mirror package assembly of claim 1 , wherein:
the MEMS wafer comprises an actuation structure configured to actuate a rotation of the MEMS mirror about at least one axis, and
the spacer wafer includes a protrusion that laterally extends over the actuation structure.

9. The MEMS mirror package assembly of claim 8 , wherein the first portion of the front cavity includes a recess formed vertically between the protrusion of the spacer wafer and the actuation structure, wherein the protrusion is vertically separated from the MEMS wafer by the recess.

10. The MEMS mirror package assembly of claim 1 , wherein a width of the first portion of the front cavity defined by the spacer wafer is equal to a width of the second portion of the front cavity defined by the transparent cover wafer.

11. The MEMS mirror package assembly of claim 1 , wherein a width of the first portion of the front cavity defined by the spacer wafer is less than a width of the second portion of the front cavity defined by the transparent cover wafer.

12. The MEMS mirror package assembly of claim 1 , further comprising:
an electrical pad formed at the frontside of the MEMS wafer; and
an opening arranged over the electrical pad, wherein the opening extends entirely through a thickness of the transparent cover wafer and a thickness of the spacer wafer to expose the electrical pad, wherein the opening is laterally displaced from the transparent dome structure.

13. The MEMS mirror package assembly of claim 1 , wherein:
the MEMS wafer is a semiconductor wafer,
the transparent cover wafer is made of glass,
the spacer wafer is a material capable of being hermetically bonded to both the transparent cover wafer and the MEMS wafer.

14. The MEMS mirror package assembly of claim 1 , further comprising:
a getter structure arranged inside the back cavity.

15. The MEMS mirror package assembly of claim 1 , further comprising:
an anti-reflective layer formed on a surface of the transparent dome structure.

16. A microelectromechanical systems (MEMS) mirror package assembly, comprising:
a MEMS wafer comprising a stator portion that is rotationally fixed and a rotor portion that includes a MEMS mirror configured to rotate about at least one axis, wherein the MEMS mirror is suspended from the stator portion over a back cavity, the MEMS wafer comprising a frontside and a backside, wherein the MEMS wafer defines a first portion of the back cavity;
a spacer wafer comprising a frontside and a backside, wherein the backside of the spacer wafer is bonded to the frontside of the MEMS wafer, wherein the spacer wafer defines a first portion of a front cavity arranged over the MEMS mirror; and
a transparent cover wafer comprising a frontside and a backside, wherein the backside of the transparent cover wafer is bonded to the frontside of the spacer wafer, wherein the transparent cover wafer comprises a transparent dome structure arranged over the MEMS mirror and defining a second portion of the front cavity,
wherein a center of the MEMS mirror is arranged at a vertex of the transparent dome structure.

17. The MEMS mirror package assembly of claim 16 , wherein the center of the MEMS mirror is arranged at a half diameter of the transparent dome structure.

18. The MEMS mirror package assembly of claim 16 , wherein:
the MEMS wafer comprises an actuation structure configured to actuate a rotation of the MEMS mirror about at least one axis, and
the spacer wafer includes a protrusion that laterally extends over the actuation structure.

19. A microelectromechanical systems (MEMS) mirror package assembly, comprising:
a MEMS wafer comprising a stator portion that is rotationally fixed and a rotor portion that includes a MEMS mirror configured to rotate about at least one axis, wherein the MEMS mirror is suspended from the stator portion over a back cavity, the MEMS wafer comprising a frontside and a backside, wherein the MEMS wafer defines a first portion of the back cavity;
a spacer wafer comprising a frontside and a backside, wherein the backside of the spacer wafer is bonded to the frontside of the MEMS wafer, wherein the spacer wafer defines a first portion of a front cavity arranged over the MEMS mirror; and
a transparent cover wafer comprising a frontside and a backside, wherein the backside of the transparent cover wafer is bonded to the frontside of the spacer wafer, wherein the transparent cover wafer comprises a transparent dome structure arranged over the MEMS mirror and defining a second portion of the front cavity,
wherein a center of the MEMS mirror is arranged substantially at a vertex of the transparent dome structure, and
wherein the transparent dome structure has a curvature that forms an imaginary circle around the MEMS mirror, with the center of the MEMS mirror being arranged substantially at a cen

Assignees

• Infineon Technologies Ag

Inventors

• Brockmeier Andre
• Bartl Ulf
• Sorschag Kurt

Classifications

• B81C1/00285

  using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters · CPC title

• B81B2201/042

  Micromirrors, not used as optical switches · CPC title

• B81C1/00317

  Packaging optical devices · CPC title

• B81C2203/0118

  Bonding a wafer on the substrate, i.e. where the cap consists of another wafer · CPC title

• B81B7/0067

  for controlling the passage of optical signals through the package · CPC title