MEMS sensor with particle filter and method for producing it

Patent metadata

Field	Value
Publication number	US-12415719-B2
Application number	US-202117376539-A
Country	US
Kind code	B2
Filing date	Jul 15, 2021
Priority date	Aug 3, 2020
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

The semiconductor device includes a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface, a first glass-based substrate, on which the MEMS chip is arranged by its first main surface, and a second substrate, which is arranged on the second main surface of the MEMS chip, wherein the MEMS chip has a first recess connected to the surroundings by way of a plurality of perforation holes arranged in the first substrate.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface;
a first glass-based substrate, on which the first main surface of the MEMS chip is arranged, wherein the first glass-based substrate includes a plurality of perforation holes;
a second substrate which is arranged on the second main surface of the MEMS chip,
wherein the first main surface of the MEMS chip has a first recess connected to an external environment by way of the plurality of perforation holes that extend through the first glass-based substrate between the first recess and the external environment,
wherein the second substrate has a second recess that is situated opposite the first recess of the MEMS chip and forms a back volume for the MEMS chip,
wherein the MEMS chip has a membrane situated between the first recess and the second recess,
wherein the first glass-based substrate includes a first through connection that extends through the first glass-based substrate,
wherein the MEMS chip has a second through connection that extends through the MEMS chip, in alignment with the first through connection; and
a metallization that extends from the second main surface of the MEMS chip, through the first through connection, and through the second through connection.

2. The semiconductor device as claimed in claim 1 , wherein the MEMS chip includes an electrical line arranged on the second main surface of the MEMS chip, and
wherein the electrical line is connected to the membrane and the metallization.

3. The semiconductor device as claimed in claim 2 , further comprising:
a metallization layer arranged on the first main surface of the MEMS chip, between the first main surface of the MEMS chip and the first glass-based substrate,
wherein the metallization layer is in contact with the metallization for electrical contact with the metallization.

4. A semiconductor device, comprising:
a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface;
a first glass-based substrate, on which the first main surface of the MEMS chip is arranged, wherein the first glass-based substrate comprises a first portion and a second portion, wherein the second portion is thinner than the first portion and includes a plurality of perforation holes, wherein the first portion and the second portion of the first glass-based substrate have a common planar surface, and wherein the first main surface of the MEMS chip is arranged on the common planar surface of the first portion and the second portion of the first glass-based substrate;
a second substrate which is arranged on the second main surface of the MEMS chip,
wherein the first main surface of the MEMS chip has a first recess connected to an external environment by way of the plurality of perforation holes that extend through the first glass-based substrate between the first recess and the external environment,
wherein the second substrate has a second recess that is situated opposite the first recess of the MEMS chip and forms a back volume for the MEMS chip,
wherein the MEMS chip has a semiconductor membrane situated between the first recess and the second recess,
wherein the first glass-based substrate includes a first through connection that extends through the first glass-based substrate,
wherein the MEMS chip has a second through connection that extends through the MEMS chip, in alignment with the first through connection; and
a metallization that extends from the second main surface of the MEMS chip, through the first through connection, and through the second through connection.

5. The semiconductor device as claimed in claim 4 , wherein the MEMS chip has a sensor or a microphone arranged in the first recess, and
wherein the second recess forms a back volume for the sensor or the microphone.

6. The semiconductor device as claimed in claim 4 , wherein:
the MEMS chip has a sensor arranged in the first recess, and
the sensor is one or more of a pressure sensor, a sound sensor, a microphone, a gas sensor, or a combined pressure and acceleration sensor.

7. The semiconductor device as claimed in claim 4 , wherein:
a diameter of each of the plurality of perforation holes is in a range of 3 μm to 50 μm.

8. The semiconductor device as claimed in claim 4 , wherein:
the plurality of perforation holes are arranged in a matrix-shaped fashion.

9. The semiconductor device as claimed in claim 1 , wherein:
the first glass-based substrate has a thickness in a range of 50 μm to 550 μm.

10. The semiconductor device as claimed in claim 1 , wherein:
the first glass-based substrate has electrical through connections that are electrically connected to the MEMS chip and extend to a main surface of the first glass-based substrate that faces away from the MEMS chip.

11. The semiconductor device as claimed in claim 1 ,
wherein the semiconductor device further comprises a hydrophobic layer applied to sidewalls of the plurality of perforation holes and to adjacent areas of the first glass-based substrate, or
wherein surfaces of the first glass-based substrate around the plurality of perforation holes are micro-structured.

12. The semiconductor device as claimed in claim 1 , wherein semiconductor surfaces of the semiconductor membrane are in direct contact with the first recess and the second recess, respectively, such that the semiconductor membrane is directly exposed to the first recess and the second recess.

13. The semiconductor device as claimed in claim 1 , wherein the first glass-based substrate has a third recess that defines the first portion and the second portion, and
wherein the first recess and the third recess are connected by the plurality of perforation holes.

14. The semiconductor device as claimed in claim 1 , further comprising:
a conductive structure arranged on a surface of the first glass-based substrate, the surface being arranged opposite to the common planar surface,
wherein the conductive structure is connected to the metallization.

15. The semiconductor device as claimed in claim 1 , further comprising:
a metallization layer arranged on the first main surface of the MEMS chip, between the first main surface of the MEMS chip and the first glass-based substrate,
wherein the metallization layer is in contact with the metallization for electrical contact with the metallization.

16. The semiconductor device as claimed in claim 15 , wherein the metallization layer has a contacting region that is in direct contact with the first main surface of the MEMS chip.

17. The semiconductor device as claimed in claim 1 , wherein the MEMS chip includes an electrical line arranged on the second main surface of the MEMS chip, and
wherein the electrical line is connected to the semiconductor membrane and the metallization.

18. The semiconductor device as claimed in claim 17 , further comprising:
a metallization layer arranged on the first main surface of the MEMS chip, between the first main surface of the MEMS chip and the first glass-based substrate,
wherein the metallization layer is in contact with the metallization for electrical contact with the metallization.

19. The semiconductor device as claimed in claim 18 , wherein the metallization layer has a contacting region that is in direct contact with the first main surface of the MEMS chip.

Assignees

• Infineon Technologies Ag

Inventors

• Brockmeier Andre
• Glanzer Barbara Angela
• Oldsen Marten
• Solazzi Francesco
• Von Koblinski Carsten

Classifications

• B81B7/0074

  3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board · CPC title

• B81B7/007

  Interconnections between the MEMS and external electrical signals · CPC title

• G01L19/0654

  against moisture or humidity · CPC title

• G01L19/0636

  using particle filters · CPC title

• B81B7/02

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title