Bonding wire for semiconductor devices
US-2018374816-A1 · Dec 27, 2018 · US
not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids
not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/553 |
| Official title | {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids} |
| Display label | not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids |
| Total patents | 141 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 14 |
| 2017 | 21 |
| 2018 | 20 |
| 2019 | 20 |
| 2020 | 11 |
| 2021 | 9 |
| 2022 | 10 |
| 2023 | 9 |
| 2024 | 8 |
| 2025 | 9 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device
US-10115656-B2 · Oct 30, 2018 · US
Hybrid nanosilver/liquid metal ink composition and uses thereof
US-2018242451-A1 · Aug 23, 2018 · US
Substrate-Less Stackable Package With Wire-Bond Interconnect
US-2018233448-A1 · Aug 16, 2018 · US
Coated bond wires for die packages and methods of manufacturing said coated bond wires
US-9997489-B2 · Jun 12, 2018 · US
Wire bonding methods and systems incorporating metal nanoparticles
US-2018138143-A1 · May 17, 2018 · US
Method of manufacturing semiconductor device
US-9972598-B2 · May 15, 2018 · US
Ink printed wire bonding
US-2018114778-A1 · Apr 26, 2018 · US
Substrate-less stackable package with wire-bond interconnect
US-9953914-B2 · Apr 24, 2018 · US
Wiring system
US-2018098437-A1 · Apr 5, 2018 · US
Package assembly with gathered insulated wires
US-9935036-B2 · Apr 3, 2018 · US
Method of manufacturing semiconductor device
US-2018082977-A1 · Mar 22, 2018 · US
Semiconductor device
US-2018061735-A1 · Mar 1, 2018 · US
LED package with covered bonding wire
US-9882107-B2 · Jan 30, 2018 · US
Wire bonding methods and systems incorporating metal nanoparticles
US-9881895-B2 · Jan 30, 2018 · US
Heat isolation structures for high bandwidth interconnects
US-9859188-B2 · Jan 2, 2018 · US
Semiconductor device
US-9837335-B2 · Dec 5, 2017 · US
Chip package, method of forming a chip package and method of forming an electrical contact
US-2017338169-A1 · Nov 23, 2017 · US
Die package with low electromagnetic interference interconnection
US-9824997-B2 · Nov 21, 2017 · US
Die packaging with fully or partially fused dielectric leads
US-9812420-B2 · Nov 7, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/553?
- CPC H10W72/553 is the Cooperative Patent Classification code for “not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids.”
- How many patents are filed under CPC H10W72/553 (not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids)?
- Our database includes 141 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/553 growing?
- Publication counts under this code: 8 in 2024 vs 9 in 2025 (latest complete years).