Multiphase resins with reduced percolation threshold
US-9657210-B1 · May 23, 2017 · US
Semiconductor device
US9837335B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9837335-B2 |
| Application number | US-201615374478-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 9, 2016 |
| Priority date | Dec 11, 2015 |
| Publication date | Dec 5, 2017 |
| Grant date | Dec 5, 2017 |
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- Title
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Abstract
Official abstract text for this publication.
Performance of a semiconductor device is improved. Graphene particles are mixedly added in a sealing resin covering a semiconductor chip. The graphene particles are thus mixedly added in the sealing resin, thereby thermal conduction of the sealing resin is improved, and thus radiation performance of the semiconductor device can be improved. Graphene is a sheet of sp 2 bonded carbon atoms having a monolayer thickness. Graphene has a structure where hexagonal lattices, each of which is formed of carbon atoms and bonds of the carbon atoms, are planarly spread. Graphene is preferably used as heat transfer filler because of its high thermal conductivity and light weight.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a semiconductor chip; and a resin material covering the semiconductor chip, the resin material containing a resin and graphene particles, and wherein content of the graphene particles in the resin material is 40 to 70 vol %. 2. The semiconductor device according to claim 1 , wherein particle size of the graphene particles is 10 to 500 μm. 3. The semiconductor device according to claim 1 , wherein the content of the graphene particles in the resin material is 60 to 70 vol %. 4. The semiconductor device according to claim 1 , wherein the resin material contains potassium ion.
Assignees
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Classifications
Multilayered bond wires, e.g. having a coating concentric around a core · CPC title
comprising aluminium [Al] · CPC title
comprising gold [Au] · CPC title
Encapsulations, e.g. protective coatings · CPC title
batch processes · CPC title
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Frequently asked questions
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- What does patent US9837335B2 cover?
- Performance of a semiconductor device is improved. Graphene particles are mixedly added in a sealing resin covering a semiconductor chip. The graphene particles are thus mixedly added in the sealing resin, thereby thermal conduction of the sealing resin is improved, and thus radiation performance of the semiconductor device can be improved. Graphene is a sheet of sp 2 bonded carbon atoms havin…
- Who is the assignee on this patent?
- Renesas Electronics Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W74/473. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 05 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).