Die packaging with fully or partially fused dielectric leads

Patent metadata

Field	Value
Publication number	US-9812420-B2
Application number	US-201414902504-A
Country	US
Kind code	B2
Filing date	Jul 2, 2014
Priority date	Jul 3, 2013
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

A die interconnect system having a first die with a plurality of connection pads, and a ribbon lead extending from the first die, the ribbon lead having a plurality of metal cores with a core diameter, and a dielectric layer surrounding the metal core with a dielectric thickness, with at least a portion of dielectric being fused between adjacent metal cores along the length of the plurality of metal cores, and an outer metal layer attached to ground.

First claim

Thus, having described the invention, what is claimed is:

1. An interconnect system, comprising
a first die having a plurality of connection pads, and
a ribbon lead having a plurality of metal cores with a core diameter, and a dielectric layer surrounding the metal core with a dielectric thickness, with at least a portion of dielectric being fused between adjacent metal cores along the length of the plurality of metal cores, and an outer metal layer attached to ground,

wherein the interconnect system is a multi-die interconnect system comprising the first die and a second die, with each die respectively having a plurality of connection pads, the ribbon lead extending from the first die to the second die.

2. The interconnect system comprising:
a first die having a plurality of connection pads, and
a ribbon lead having a plurality of metal cores with a core diameter, and a dielectric layer surrounding the metal core with a dielectric thickness, with at least a portion of dielectric being fused between adjacent metal cores along the length of the plurality of metal cores, and an outer metal layer attached to ground,

wherein the interconnect system is a through line interconnect system comprising the first die and a second die, with each die respectively having a plurality of connection pads, the ribbon lead extending from the first die to the second die.

3. The interconnect system of claim 1 , wherein the outer metal layer covers the fused dielectric only partially.

4. The interconnect system of claim 1 , wherein the dielectric is completely or alternatively only partially fused along the length of the lead.

5. The interconnect system of claim 1 , wherein the second die is smaller than the first die, wherein only a limited length of the lead near the smaller die has fused dielectric.

6. The interconnect system of claim 1 , including at least one preferably stacked die with a first die and a second die, the ribbon lead extending from the first die to the second die, from the first die to another die not being part of the stacked die and/or to a die substrate.

7. The interconnect system of claim 1 , including a first die package and a second die package, the ribbon lead extending from the first die package to the second die package.

8. The interconnect system of claim 1 , including at least one active or passive element like an antenna or an antenna system, the ribbon lead extending from the first die to the active and/or passive element.

9. The interconnect system of claim 1 in the form of a large die-to-small die interconnect structure, with one or more leads forming a ribbon lead for at least a portion of their length.

10. The interconnect system of claim 1 , wherein the dielectric layer surrounding a first core has a first thickness and the dielectric layer surrounding a second core has a second thickness differing from the first thickness.

11. The interconnect system of claim 1 , wherein the outer metal layer is exposed to ambient conditions to facilitate heat transfer.

12. The interconnect system of claim 1 , wherein the lead is convectively or contact cooled by an active and/or passive heat sink like moving air or liquid, high thermal conductivity metal, thermal pastes or thermally transmissive adhesives, and/or active cooling agents such as piezoelectric coolers.

13. The interconnect system of claim 1 , wherein the lead extends from the first die to a heat sink.

14. The interconnect system of claim 1 adapted for a ball grid array (BGA) package.

15. The interconnect system of claim 1 adapted for a leadframe package.

16. The interconnect system of claim 1 operational within a thermal transfer system for a packaged die, the lead extending from the first die to a heat sink.

17. The interconnect system of claim 16 , wherein the heat sink is a substrate, an adhesive layer, a thermally conductive past and/or a metal slug.

18. The interconnect system of claim 5 , including at least one preferably stacked die with a first die and a second die, the ribbon lead extending from the first die to the second die, from the first die to another die not being part of the stacked die and/or to a die substrate.

Assignees

• Rosenberger Hochfrequenztechnik Gmbh & Co Kg

Inventors

• Cahill Sean S
• Sanjuan Eric A

Classifications

• H10W90/759

  between a chip and a laterally-adjacent discrete passive device · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/752

  between stacked chips · CPC title