Die package with low electromagnetic interference interconnection

Patent metadata

Field	Value
Publication number	US-9824997-B2
Application number	US-201414902510-A
Country	US
Kind code	B2
Filing date	Jul 2, 2014
Priority date	Jul 3, 2013
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A die package having lead structures connecting to a die that provide for electromagnetic interference reductions. Mixed impedance leads connected to the die have a first lead with a first metal core, a dielectric layer surrounding the first metal core, and first outer metal layer connected to ground; and a second lead with a second metal core, and a second dielectric layer surrounding the second metal core, and a second outer metal layer connected to ground. Each lead reducing susceptibility to EMI and crosstalk.

First claim

Thus, having described the invention, what is claimed is:

1. A die package comprising:
a die having a plurality of connection pads;
a die substrate supporting a plurality of connection elements;
a first lead having a first metal core with a first metal core diameter, a first dielectric layer surrounding said first metal core having a first dielectric thickness, and a first outer metal layer surrounding said first dielectric layer, said first outer metal layer attached to a first ground plane; and
a second lead having a second metal core with a second metal core diameter, a second dielectric layer surrounding said second metal core having a second dielectric thickness, and a second outer metal layer surrounding said second dielectric layer, said second outer metal layer attached to a second ground plane;
such that susceptibility to EMI and crosstalk between the first and second leads are reduced, wherein the first ground plane is separate and distinct from the second ground plane.

2. The die package of claim 1 , wherein the first lead extends from a first die to one of the plurality of connection elements on the die substrate, and the second lead extends from a second die to one of the plurality of connection elements on the die substrate, the first ground plane attached to said first outer metal layer and the second ground plane attached to said second outer metal layer.

3. The die package of claim 1 , wherein the first metal core diameter differs from the second metal core diameter, or alternatively, wherein the first metal core diameter is the same as the second metal core diameter.

4. The die package of claim 1 wherein the die package includes a first and a second die, each of said dies having a plurality of connection pads, the first lead extending from said first die to one of said plurality of connection elements on said die substrate or to one of said plurality of connection pads of said second die, and the second lead extending from said second die to one of said plurality of connection elements on said die substrate or to one of said plurality of connection pads of said first die.

5. The die package of claim 1 wherein, the first dielectric layer thickness differs from the second dielectric layer thickness, or alternatively, wherein the first dielectric layer thickness is the same as the second dielectric layer thickness.

6. The die package of claim 1 , wherein the die package is a stacked die package.

7. The die package of claim 1 , wherein said die substrate includes filled via to allow formation of a BGA package.

8. The die package of claim 1 , wherein the die substrate includes a leadframe to form a leadframe package.

9. The die package of claim 1 , wherein the first lead crosses over the second lead and/or is above the second lead.

10. The die package of claim 1 , wherein the first lead has a first length and a first impedance and the second lead has a second length and a second impedance, wherein said first length is different from said second length and/or said first impedance is different from said second impedance.

11. The die package of claim 1 , wherein said first metal core and/or said second metal core is sequentially coated with a dielectric layer and a conductive metal layer.

12. The die package of claim 1 , wherein the first and second leads provide electrical communication for die-to-die connection and/or die-to-substrate connection.

13. The die package of claim 1 , wherein of the first and second leads include at least one differential pair.

14. The die package of claim 1 wherein the first and second leads include crossover, long loop leads out of plane with reduced crosstalk.

15. A die package comprising:
a die having a plurality of connection pads;
a die substrate supporting a plurality of connection elements;
a first lead having a first metal core with a first metal core diameter, a first dielectric layer surrounding said first metal core having a first dielectric thickness, and a first outer metal layer surrounding said first dielectric layer, said first outer metal layer attached to a first ground plane; and
a second lead having a second metal core with a second metal core diameter, a second dielectric layer surrounding said second metal core having a second dielectric thickness, and a second outer metal layer surrounding said second dielectric layer, said second outer metal layer attached to a second ground plane;
such that susceptibility to EMI and crosstalk between the first and second leads are reduced;
wherein the first ground plane is separate and distinct from the second ground plane;
wherein the first lead extends from a first die to one of the plurality of connection elements on the die substrate, and the second lead extends from a second die to one of the plurality of connection elements on the die substrate, the first ground plane attached to said first outer metal layer and the second ground plane attached to said second outer metal layer; and
wherein the second ground plane overlays the first ground plane with an intervening layer maintaining electrical isolation between the first and second ground plane.

16. A BGA package with superior EMI performance including a die package comprising:
a die having a plurality of connection pads;
a die substrate supporting a plurality of connection elements;
a first lead having a first metal core with a first metal core diameter, a first dielectric layer surrounding said first metal core having a first dielectric thickness, and a first outer metal layer surrounding said first dielectric layer, said first outer metal layer attached to a first ground plane; and
a second lead having a second metal core with a second metal core diameter, a second dielectric layer surrounding said second metal core having a second dielectric thickness, and a second outer metal layer surrounding said second dielectric layer, said second outer metal layer attached to a second ground plane;
such that susceptibility to EMI and crosstalk between the first and second leads are reduced wherein said crosstalk noise is reduced at least 5 dB as compared to leads without a dielectric layer surrounding the metal core and having an outer metal layer,
wherein the first ground plane is separate and distinct from the second ground plane.

17. A die package comprising:
a die having a plurality of connection pads;
a die substrate supporting a plurality of connection elements;
a first lead having a first metal core with a first metal core diameter, a first dielectric layer surrounding said first metal core having a first dielectric thickness, and a first outer metal layer surrounding said first dielectric layer, said first outer metal layer attached to a first ground plane; and
a second lead having a second metal core with a second metal core diameter, a second dielectric layer surrounding said second metal core having a second dielectric thickness, and a second outer metal layer surrounding said second dielectric layer, said second outer metal layer attached to a second ground plane;
such that susceptibility to EMI and crosstalk between the first and second leads are reduced, and wherein the first ground plane and the second ground plane are electrically distinct, but physically overlap.

Assignees

• Rosenberger Hochfrequenztechnik Gmbh & Co Kg

Inventors

• Cahill Sean S
• Sanjuan Eric A

Classifications

• H10W72/543

  of outermost layers of multilayered bond wires, e.g. coating being only on a part of a core · CPC title

• H10W72/522

  Multilayered bond wires, e.g. having a coating concentric around a core · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/28

  the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape · CPC title

• H10W72/0198

  batch processes · CPC title