LED package with covered bonding wire

Patent metadata

Field	Value
Publication number	US-9882107-B2
Application number	US-201715404630-A
Country	US
Kind code	B2
Filing date	Jan 12, 2017
Priority date	Jan 12, 2016
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

Provided is an LED package which is unlikely to cause the attenuation of emitted light from an LED element by bonding wires for electrical connection of the LED element. The LED package includes a board including a pair of connection electrodes formed thereon, an LED element mounted on the board, a bonding wire electrically connecting the LED element to the pair of connection electrodes, and a covering layer containing a phosphor and covering the bonding wire, wherein the phosphor is excited by emitted light from the LED element to emit light having an absorbance in the bonding wire lower than that of the emitted light and a wavelength longer than that of the emitted light.

First claim

What is claimed is:

1. An LED package comprising:
a board comprising a pair of connection electrodes formed thereon;
an LED element mounted on the board;
a bonding wire made of silver and electrically connecting the LED element to the pair of connection electrodes;
a protective layer which is made of silicon dioxide, wherein the protective layer covers a surface of the bonding wire and protects the bonding wire from corrosion; and
a covering layer containing a phosphor and covering the bonding wire and the protective layer,
wherein the phosphor is excited by emitted light from the LED element to emit light having an absorbance in the bonding wire lower than that of the emitted light and a wavelength longer than that of the emitted light.

2. The LED package according to claim 1 , further comprising a sealing resin which contains a second phosphor excited by the emitted light to emit second light, and which integrally seals the LED element, the bonding wire, and the covering layer,
wherein the phosphor in the covering layer emits light having a wavelength longer than that of the second light.

3. The LED package according to claim 2 , further comprising a board-covering layer which contains a third phosphor and covers a conductive pattern on the board,
wherein the third phosphor is excited by the emitted light to emit light having an absorbance in the conductive pattern lower than that of the emitted light and a wavelength longer than those of the emitted light and the second light.

4. The LED package according to claim 1 , wherein
the LED element is an element emitting blue light as the emitted light,
and
the phosphor in the covering layer is a phosphor emitting red light.

5. An LED package comprising:
a board comprising a pair of connection electrodes formed thereon;
an LED element mounted on the board;
a bonding wire electrically connecting the LED element to the pair of connection electrodes;
a covering layer containing a first phosphor and covering the bonding wire, wherein the first phosphor is excited by emitted light from the LED element to emit light having an absorbance in the bonding wire lower than that of the emitted light and a wavelength longer than that of the emitted light;
a protective layer which covers a surface of the covering layer and protects the bonding wire from corrosion; and
a sealing resin which contains a second phosphor excited by the emitted light to emit second light, and which integrally seals the LED element, the boning wire, the covering layer and the protective layer,
wherein the first phosphor emits light having a wavelength longer than that of the second light, and
a lower half portion of the protective layer, closer to the board and the LED element, is made of a material having a refractive index lower than that of the sealing resin.

6. An LED package comprising:
a board comprising a pair of connection electrodes formed thereon;
an LED element mounted on the board;
a bonding wire made of silver and electrically connecting the LED element to the pair of connection electrodes;
a covering layer containing a phosphor and covering the bonding wire; and
a protective layer which is made of silicon dioxide, wherein the protective layer covers a surface of the covering layer and protects the bonding wire from corrosion,
wherein the phosphor is excited by emitted light from the LED element to emit light having an absorbance in the bonding wire lower than that of the emitted light and a wavelength longer than that of the emitted light.

7. The LED package according to claim 5 , further comprising a board-covering layer which contains a third phosphor and covers a conductive pattern on the board,
wherein the third phosphor is excited by the emitted light to emit light having an absorbance in the conductive pattern lower than that of the emitted light and a wavelength longer than those of the emitted light and the second light.

8. The LED package according to claim 5 , wherein
the LED element is an element emitting blue light as the emitted light,
the bonding wire is a gold wire made of gold, and
the first phosphor is a phosphor emitting red light.

9. The LED package according to claim 6 , further comprising a sealing resin which contains a second phosphor excited by the emitted light to emit second light, and which integrally seals the LED element, the bonding wire, and the covering layer,
wherein the phosphor in the covering layer emits light having a wavelength longer than that of the second light.

10. The LED package according to claim 9 , further comprising a board-covering layer which contains a third phosphor and covers a conductive pattern on the board,
wherein the third phosphor is excited by the emitted light to emit light having an absorbance in the conductive pattern lower than that of the emitted light and a wavelength longer than those of the emitted light and the second light.

11. The LED package according to claim 6 , wherein
the LED element is an element emitting blue light as the emitted light, and
the phosphor in the covering layer is a phosphor emitting red light.

Assignees

• Citizen Electronics
• Citizen Watch Co Ltd

Inventors

• Iino Takashi

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5525

  comprising copper [Cu] · CPC title

• H10W72/5524

  comprising aluminium [Al] · CPC title