Package component
US-2024215150-A1 · Jun 27, 2024 · US
characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182)
characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/243 |
| Official title | {characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182)} |
| Display label | characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182) |
| Total patents | 187 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 23 |
| 2016 | 19 |
| 2017 | 23 |
| 2018 | 20 |
| 2019 | 20 |
| 2020 | 13 |
| 2021 | 11 |
| 2022 | 15 |
| 2023 | 10 |
| 2024 | 20 |
| 2025 | 11 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Printed wiring board and method for manufacturing the same
US-2017317017-A1 · Nov 2, 2017 · US
Light emitting package having a guiding member guiding an optical member
US-2017271569-A1 · Sep 21, 2017 · US
Printed wiring board and method for manufacturing the same
US-2017245365-A1 · Aug 24, 2017 · US
Printed wiring board
US-2017231087-A1 · Aug 10, 2017 · US
Amino sulfonic acid based polymers for copper electroplating
US-9725816-B2 · Aug 8, 2017 · US
Light emitting package having a guiding member guiding an optical member
US-9705059-B2 · Jul 11, 2017 · US
Method of manufacturing wiring substrate, and wiring substrate
US-9699916-B2 · Jul 4, 2017 · US
Wiring board
US-9693453-B2 · Jun 27, 2017 · US
Methods and devices for preventing overhangs in a finishing layer of metal formed on electrical contact surfaces when fabricating multi-layer printed circuit boards
US-9668340-B1 · May 30, 2017 · US
Electronic device, electronic apparatus, method of manufacturing base substrate, and method of manufacturing electronic device
US-9635769-B2 · Apr 25, 2017 · US
Flexible circuit board and method for manufacturing same
US-9622340-B2 · Apr 11, 2017 · US
Interconnect structure configured to control solder flow and method of manufacturing of same
US-9609752-B1 · Mar 28, 2017 · US
Electronic package with narrow-factor via including finish layer
US-9603247-B2 · Mar 21, 2017 · US
Amino sulfonic acid based polymers for copper electroplating
US-9598786-B2 · Mar 21, 2017 · US
Wiring substrate and method of manufacturing wiring substrate
US-9572252-B2 · Feb 14, 2017 · US
Method of electrochemically fabricating multilayer structures having improved interlayer adhesion
US-9567687-B2 · Feb 14, 2017 · US
Printed wiring board, semiconductor package, and method for manufacturing printed wiring board
US-2017033036-A1 · Feb 2, 2017 · US
Printed wiring board and method for manufacturing printed wiring board
US-9532468-B2 · Dec 27, 2016 · US
Printed circuit board and method for manufacturing same
US-2016353582-A1 · Dec 1, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/243?
- CPC H05K3/243 is the Cooperative Patent Classification code for “characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182).”
- How many patents are filed under CPC H05K3/243 (characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182))?
- Our database includes 187 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/243 growing?
- Publication counts under this code: 20 in 2024 vs 11 in 2025 (latest complete years).