Wiring board

Patent metadata

Field	Value
Publication number	US-9693453-B2
Application number	US-201314019863-A
Country	US
Kind code	B2
Filing date	Sep 6, 2013
Priority date	Sep 7, 2012
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

A wiring board includes a base layer, a plurality of connection terminals and a surface layer. The base layer is electrically insulative. The plurality of connection terminals are conductive and formed on the base layer. The surface layer is electrically insulative, and fills gaps between the plurality of connection terminals on the base layer. The connection terminals include a base portion made of a conductive first metal and a coating portion made of a conductive second metal that is different from the first metal. The coating portion penetrates the surface layer, and coats the base portion to the base layer.

First claim

What is claimed is:

1. A wiring board, comprising:
an electrically insulating base layer;
a plurality of conductive connection terminals formed on the base layer; and
an electrically insulating surface layer filling gaps between the plurality of connection terminals on the base layer, the electrically insulating surface layer formed in a state in which the connection terminals are exposed therefrom with an upper surface of the electrically insulating surface layer lower than a top surface of the plurality of conductive connection terminals,
wherein the connection terminals include:
a base portion made of a conductive first metal that includes copper, and
a coating portion made of a conductive second metal that is different from the first metal, and that penetrates the electrically insulating surface layer and coats the base portion to the base layer;
wherein the base portion is a copper-plated layer; and
wherein progress of migration of the second metal occurring between the respective connection terminals in the plurality of connection terminals is slower than migration of the first metal.

2. The wiring board according to claim 1 , wherein:
the second metal includes nickel (Ni) or tin (Sn).

Assignees

• Ngk Spark Plug Co
• Ngk Spark Plus Co Ltd

Inventors

• Hayashi Takahiro
• Mori Seiji
• Ito Tatsuya

Classifications

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title