Light emitting package having a guiding member guiding an optical member

Patent metadata

Field	Value
Publication number	US-9705059-B2
Application number	US-201615156030-A
Country	US
Kind code	B2
Filing date	May 16, 2016
Priority date	Dec 17, 2004
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

A light emitting device package including a base including a top flat surface; an insulating layer on the base; a light emitting diode on the base; an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough; a guiding member to guide the optical member, the guiding member having a ring shape; an electrical circuit layer electrically connected to the light emitting diode, the electrical circuit layer including an electrode portion and an extended portion, the electrode portion disposed inside the guiding member and electrically connected to the light emitting diode, the extended portion extended from the electrode portion to outside the guiding member; and an electrode layer on the electrode portion of the electrical circuit layer and electrically connected to the light emitting diode.

First claim

What is claimed is:

1. A light emitting device package, comprising:
a base including a top flat surface;
an insulating layer on the base;
a light emitting diode on a region of the top flat surface of the base, wherein the region is an area where the insulating layer is not disposed on the base;
an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough;
a guiding member to guide the optical member, the guiding member having a ring shape and surrounding the region of the base;
a first electrical circuit layer disposed on the insulating layer and including a first portion disposed between a top surface of the insulating layer and a first portion of a bottom surface of the guiding member; and
a second electrical circuit layer disposed on the insulating layer and including a second portion disposed between the top surface of the insulation layer and a second portion of the bottom surface of the guiding member,
wherein the first electrical circuit layer includes a first extension portion and a second extension portion, the first extension portion extends from the first portion of the first electrical circuit layer beyond an outside edge of the guiding member in a first direction, and the second extension portion extends from an end of the first extension portion in a second direction,
wherein the second electrical circuit layer includes a third extension portion and a fourth extension portion, the third extension portion extends from the second portion of the second electrical circuit layer beyond an outside edge of the guiding member in a third direction, and the fourth extension portion extends from an end of the third extension portion in a fourth direction, and
wherein the first direction and the third direction are antiparallel each other.

2. The light emitting device package of claim 1 , wherein the guiding member includes an inner surface contacting the optical member and an outer surface exposed from the optical member.

3. The light emitting device package of claim 1 , wherein the optical member contacts the guiding member and the region of the base.

4. The light emitting device package of claim 1 , wherein the optical member and the guiding member are horizontally overlapped.

5. The light emitting device package of claim 1 , wherein the optical member covers the light emitting diode.

6. The light emitting device package of claim 1 , wherein an edge portion of the optical member contacts the guiding member.

7. The light emitting device package of claim 1 , wherein a width of the base is greater than a width of the region surrounded by the guiding member.

8. The light emitting device package of claim 1 , wherein the first electrical circuit layer and the light emitting diode are electrically connected using a wire and the optical member is disposed on the wire.

9. The light emitting device package of claim 1 , wherein a bottom surface of the guiding member is disposed higher than a top surface of the light emitting diode.

10. The light emitting device package of claim 1 , wherein the first electrical circuit layer includes a fifth extension portion extended from an end portion of the second extension portion in a fifth direction.

11. The light emitting device package of claim 1 , wherein a thickness of a portion of the base where the light emitting diode is disposed and a thickness of a portion of the base where the insulating layer is disposed are the same.

12. The light emitting device package of claim 1 , wherein the bottom surface of the guiding member is disposed higher than a bottom surface of the optical member.

13. A light emitting device package, comprising:
a base having a flat top surface;
an insulating layer on the base;
a light emitting diode on a region of the flat top surface of the base, wherein the region is an area where the insulating layer is not disposed on the base, and the insulating layer surrounds the region of the base;
an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough;
a guiding member to guide the optical member, the guiding member having a ring shape and surrounding the region of the base;
a first electrical circuit layer disposed on the insulating layer and including a first portion disposed between a top surface of the insulating layer and a first portion of a bottom surface of the guiding member; and
a second electrical circuit layer disposed on the insulating layer and including a second portion disposed between the top surface of the insulation layer and a second portion of the bottom surface of the guiding member,
wherein the first electrical circuit layer includes a first extension portion extended from the first portion of the first electrical circuit layer beyond an outside edge of the guiding member in a first direction,
wherein the second electrical circuit layer includes a second extension portion extended from the second portion of the second electrical circuit layer beyond an outside edge of the guiding member in a second direction,
wherein the first direction and the second direction are antiparallel each other,
wherein the first electrical circuit layer and the second electrical circuit layer are not disposed on the region of the base,
wherein the bottom surface of the guiding member is disposed higher than a bottom surface of the optical member, and
wherein the base includes a fastening hole.

14. The light emitting device package of claim 13 , wherein the guiding member includes an inner surface contacting the optical member and an outer surface exposed from the optical member.

15. The light emitting device package of claim 13 , wherein the optical member contacts the guiding member and the region of the base.

16. The light emitting device package of claim 13 , wherein the optical member and the guiding member are horizontally overlapped.

17. The light emitting device package of claim 13 , wherein the optical member covers the light emitting diode.

18. The light emitting device package of claim 13 , wherein an edge portion of the optical member contacts the guiding member.

19. The light emitting device package of claim 13 , wherein a width of the base is greater than a width of a region surrounded by the guiding member.

20. The light emitting device package of claim 13 , wherein the first electrical circuit layer and the light emitting diode are electrically connected using a wire and the optical member disposed on the wire.

21. The light emitting device package of claim 13 , wherein a bottom surface of the guiding member is disposed higher than a top surface of the light emitting diode.

22. The light emitting device package of claim 13 , wherein the base comprises metal material.

Assignees

• Lg Innotek Co Ltd
• Lg Innotek Co Ltd

Inventors

• Park Jun Seok

Classifications

• H05K1/182

  associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] · CPC title

• H05K1/021

  Components thermally connected to metal substrates or heat-sinks by insert mounting · CPC title

• H05K1/056

  the metal substrate being covered by an organic insulating layer · CPC title

• F21K9/00

  Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title