Flexible circuit board and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-9622340-B2
Application number	US-201514858953-A
Country	US
Kind code	B2
Filing date	Sep 18, 2015
Priority date	Jul 24, 2015
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on the first face. The metal coating layer has a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line. The grounding lines are at two opposite sides of the linear signal line on the first face. The circuit layer is on the second face. The electromagnetic shielding layer covers the linear signal line and the grounding lines. The linear signal line and the grounding lines are between the electromagnetic shielding layer and the circuit layer. A method for manufacturing the flexible circuit board is also provided.

First claim

What is claimed is:

1. A flexible circuit board comprising:
an insulating layer comprising a first face and a second face opposite to the first face;
a linear signal line located on the first face of the insulating layer;
a metal coating layer covering the linear signal line on the first face of the insulating layer, and having a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line;
a plurality of grounding lines located on the first face of the insulating layer, and located at two opposite sides of the linear signal line;
a circuit layer located on the second face of the insulating layer; and
an electromagnetic shielding layer covering the linear signal line and the grounding lines;
wherein the linear signal line and the grounding lines are located between the electromagnetic shielding layer and the circuit layer.

2. The flexible circuit board of claim 1 , further comprising a protecting layer covering the linear signal line, wherein the protecting layer is located between the linear signal line and the electromagnetic shielding layer.

3. The flexible circuit board of claim 2 , wherein the protecting layer further covers the grounding lines.

4. The flexible circuit board of claim 2 , wherein the protecting layer separates the linear signal line and the metal coating layer from the electromagnetic shielding layer.

5. The flexible circuit board of claim 4 , wherein the protecting layer encloses the metal coating layer and the linear signal line on the insulating layer.

6. The flexible circuit board of claim 2 , further comprising a plurality of conductive members electrically connecting the grounding lines and the circuit layer.

7. The flexible circuit board of claim 6 , wherein each of the conductive members extends through a corresponding grounding lines and the insulating layer.

8. The flexible circuit board of claim 7 , wherein the protecting layer exposes the conductive members to the electromagnetic shielding layer.

9. The flexible circuit board of claim 8 , wherein the electromagnetic shielding layer covers the conductive members.

10. The flexible circuit board of claim 1 , further comprising a protecting layer covering the circuit layer, wherein the circuit layer is located between the insulating layer and the protecting layer.

11. The flexible circuit board of claim 1 , wherein the metal coating layer is silver.

12. The flexible circuit board of claim 1 , wherein the grounding lines are parallel to each other.

13. A method for manufacturing a flexible circuit board, comprising:
providing an insulating layer comprising a first face and a second face opposite to the first face;
forming a linear signal line and a plurality of grounding lines at two opposite sides of the linear signal line on the first face of the insulating layer;
forming a circuit layer on the second face of the insulating layer;
forming a metal coating layer covering surfaces of the linear signal line, the metal coating layer having a thickness less than that of the linear signal line and an electrical conductivity larger than that of the linear signal line; and
providing an electromagnetic shielding layer covering the linear signal line and the grounding lines to make the linear signal line located between the electromagnetic shielding layer and the circuit layer.

14. The method of claim 13 , before forming the linear signal line, further comprising:
forming a plurality of conductive members extending through the insulating layer.

15. The method of claim 14 , wherein each of the conductive members extends through a corresponding grounding line and the insulating layer and connects a corresponding grounding line and the circuit layer.

16. The method of claim 14 , before providing the electromagnetic shielding layer, further comprising: providing the protecting layer covering the linear signal line and the grounding lines, the protecting layer exposing the conductive members.

17. The method of claim 16 , wherein the protecting layer separates the linear signal line and the metal coating layer from the electromagnetic shielding layer.

18. The method of claim 13 , wherein the metal coating layer is formed by electroplating or chemical deposit.

19. The method of claim 18 , wherein the metal coating layer is silver.

20. The method of claim 13 , wherein the linear signal line and the grounding lines are formed by etching a copper foil on the first face of the insulating layer.

Assignees

• Hongqisheng Prec Electronics (Qinhuangdao) Co Ltd
• Fukui Prec Component (Shenzhen) Co Ltd
• Zhen Ding Tech Co Ltd
• Garuda Tech Co Ltd

Inventors

• Hu xian-qin
• Li yan-lu
• Yu Wen-Hsin
• Ho Ming-Jaan

Classifications

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K1/0237

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title

• H05K1/0228 Primary

  Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245) · CPC title