Transparent composite article with electrically-conductive pattern
US-2025034345-A1 · Jan 30, 2025 · US
means therefor, e.g. baths, apparatus
means therefor, e.g. baths, apparatus · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/187 |
| Official title | {means therefor, e.g. baths, apparatus} |
| Display label | means therefor, e.g. baths, apparatus |
| Total patents | 50 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 13 |
| 2017 | 11 |
| 2018 | 8 |
| 2019 | 4 |
| 2020 | 3 |
| 2021 | 2 |
| 2022 | 1 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of making transparent composite articles
US-2025033327-A1 · Jan 30, 2025 · US
Article with electrically-conductive pattern
US-2025037900-A1 · Jan 30, 2025 · US
Aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer, method and use thereof
US-2022033972-A1 · Feb 3, 2022 · US
Formation of terminal metallurgy on laminates and boards
US-11168400-B2 · Nov 9, 2021 · US
Electroless copper plating bath
US-2021262096-A1 · Aug 26, 2021 · US
Elimination of H2S in immersion tin plating solution
US-10774425-B2 · Sep 15, 2020 · US
Clamper and holding jig including same
US-10669643-B2 · Jun 2, 2020 · US
Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias
US-10640874-B2 · May 5, 2020 · US
Formation of terminal metallurgy on laminates and boards
US-2019390348-A1 · Dec 26, 2019 · US
Plating bath composition and method for electroless plating of palladium
US-10513780-B2 · Dec 24, 2019 · US
Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias
US-2019048472-A1 · Feb 14, 2019 · US
Method for producing electroconductive laminate, laminate, and electroconductive laminate
US-2019010608-A1 · Jan 10, 2019 · US
Elimination of H2S in Immersion Tin Plating Solution
US-2018347038-A1 · Dec 6, 2018 · US
Plating bath composition and method for electroless plating of palladium
US-2018340260-A1 · Nov 29, 2018 · US
Plating bath composition and method for electroless plating of palladium
US-2018340261-A1 · Nov 29, 2018 · US
Plating apparatus and method for determining plating bath configuration
US-2018274116-A1 · Sep 27, 2018 · US
Tin or tin alloy plating liquid
US-9926637-B2 · Mar 27, 2018 · US
Pre-treatment process for electroless plating
US-9896765-B2 · Feb 20, 2018 · US
Electroless copper plating compositions
US-9869026-B2 · Jan 16, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/187?
- CPC H05K3/187 is the Cooperative Patent Classification code for “means therefor, e.g. baths, apparatus.”
- How many patents are filed under CPC H05K3/187 (means therefor, e.g. baths, apparatus)?
- Our database includes 50 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/187 growing?
- Publication counts under this code: 1 in 2022 vs 3 in 2025 (latest complete years).