Plating apparatus and method for determining plating bath configuration

Patent metadata

Field	Value
Publication number	US-2018274116-A1
Application number	US-201815925490-A
Country	US
Kind code	A1
Filing date	Mar 19, 2018
Priority date	Mar 22, 2017
Publication date	Sep 27, 2018
Grant date	—

Abstract

There is provided a plating apparatus for plating a rectangular substrate using a substrate holder holding the rectangular substrate. The plating apparatus comprises a plating bath configured to store the substrate holder holding the rectangular substrate, and an anode disposed inside the plating bath so as to face the substrate holder. The substrate holder includes an electrical contact configured to feed two opposite sides of the rectangular substrate. The rectangular substrate and the anode are placed inside the plating bath so as to satisfy the relationship of 0.59×L 1 −43.5 mm≤D 1 ≤0.58×L 1 −19.8 mm, where L 1 is the shortest distance between a substrate center of the rectangular substrate and the electrical contact, and D 1 is the distance between the rectangular substrate and the anode.

First claim

What is claimed is:

1 . A plating apparatus for plating a rectangular substrate using a substrate holder holding the rectangular substrate, the plating apparatus comprising:
a plating bath configured to store the substrate holder holding the rectangular substrate, and an anode disposed inside the plating bath so as to face the substrate holder, wherein the substrate holder includes an electrical contact configured to feed two opposite sides of the rectangular substrate, and the rectangular substrate and the anode are placed inside the plating bath so as to satisfy the relationship of
0.59× L 1−43.5 mm≤ D 1≤0.58× L 1−19.8 mm, where

L 1 is a distance between a substrate center of the rectangular substrate and the electrical contact, and D 1 is a distance between the rectangular substrate and the anode.

2 . The plating apparatus according to claim 1 , further comprising
a regulation plate disposed between the substrate holder and the anode, wherein the regulation plate includes a cylindrical portion forming an opening for passing electric force lines, and the cylindrical portion has a length satisfying a relationship of
B 1=0.33 ×L 1−43.3 mm, where

B 1 denotes the length of the cylindrical portion.

3 . The plating apparatus according to claim 1 , further comprising
a regulation plate disposed between the substrate holder and the anode, wherein the regulation plate includes a cylindrical portion forming an opening for passing electric force lines, and satisfies a relationship of
A 1=20.8 mm, where
A 1 denotes the distance between the surface of the rectangular substrate stored in the plating apparatus and the cylindrical portion.

4 . A method for determining a configuration of a plating bath, wherein the plating bath stores a substrate holder holding a rectangular substrate, an anode holder holding an anode and including an anode mask shielding a part of the anode, and a regulation plate disposed between the substrate holder and the anode holder,
the method determining each numerical value of an opening shape of the anode mask, an opening shape of a cylindrical portion of the regulation plate, a distance between the rectangular substrate and the anode, a distance between the rectangular substrate and the cylindrical portion of the regulation plate, and a length of the cylindrical portion of the regulation plate, the method comprising: a first step of determining a numerical value of the opening shape of the anode mask having minimal variation in film thickness distribution of the rectangular substrate in a state where each of the numerical values other than the opening shape of the anode mask is set to a predetermined value; a second step of determining a numerical value of the opening shape of the cylindrical portion of the regulation plate having minimal variation in film thickness distribution of the rectangular substrate in a state where each of the numerical values other than the opening shape of the anode mask and the opening shape of the cylindrical portion of the regulation plate is set to a predetermined value and the opening shape of the anode mask is set to the value determined in the first step; a third step of determining a numerical value of the distance between the rectangular substrate and the anode having minimal variation in film thickness distribution of the rectangular substrate in a state where each of the numerical values of the distance between the rectangular substrate and the regulation plate and the length of the cylindrical portion of the regulation plate is set to a predetermined value, the opening shape of the anode mask is set to the value determined in the first step, and the opening shape of the cylindrical portion of the regulation plate is set to the value determined in the second step; a fourth step of determining a distance between the rectangular substrate and the regulation plate having minimal variation in film thickness distribution of the rectangular substrate in a state where a numerical value of the length of the cylindrical portion of the regulation plate is set to a predetermined value, the opening shape of the anode mask is set to the value determined in the first step, the opening shape of the cylindrical portion of the regulation plate is set to the value determined in the second step, the distance between the rectangular substrate and the anode is set to the value determined in the third step; and a fifth step of determining a length of the cylindrical portion of the regulation plate having minimal variation in film thickness distribution of the rectangular substrate in a state where the opening shape of the anode mask is set to the value determined in the first step, the opening shape of the cylindrical portion of the regulation plate is set to the value determined in the second step, the distance between the rectangular substrate and the anode is set to the value determined in the third step, and the distance between the rectangular substrate and the regulation plate is set to the value determined in the fourth step.

5 . The method according to claim 4 , further comprising:
a sixth step of redetermining the opening shape of the anode mask having minimal variation in film thickness distribution of the rectangular substrate in a state where the opening shape of the cylindrical portion of the regulation plate is set to the value determined in the second step, the distance between the rectangular substrate and the anode is set to the value determined in the third step, the distance between the rectangular substrate and the regulation plate is set to the value determined in the fourth step, and the length of the cylindrical portion of the regulation plate is set to the value determined in the fifth step; a seventh step of redetermining the opening shape of the cylindrical portion of the regulation plate having minimal variation in film thickness distribution of the rectangular substrate in a state where the opening shape of the anode mask is set to the value determined in the sixth step, the distance between the rectangular substrate and the anode is set to the value determined in the third step, the distance between the rectangular substrate and the regulation plate is set to the value determined in the fourth step, and the length of the cylindrical portion of the regulation plate is set to the value determined in the fifth step; an eighth step of redetermining the distance between the rectangular substrate and the anode having minimal variation in film thickness distribution of the rectangular substrate in a state where the opening shape of the anode mask is set to the value determined in the sixth step, the opening shape of the cylindrical portion of the regulation plate is set to the value determined in the seventh step, the distance between the rectangular substrate and the regulation plate is set to the value determined in the fourth step, and the length of the cylindrical portion of the regulation plate is set to the value determined in the fifth step; a ninth step of redetermining the distance between the rectangular substrate and the regulation plate having minimal variation in film thickness distribution of the rectangular substrate in a state where the opening shape of the anode mask is set to the value determined in the sixth step, the opening shape of the cylindrical portion of the regulation plate is set to the value determined in the seventh step, the distance between the rectangular substrate and the anode is set to the value determined in the eighth step, and the length of the cylindrical portion of the regulation plate is set to the value determined in the fifth step; and a tenth step of redetermining the length of the cylindrical portion of the regulation plate having minimal variation in film thickness distr

Assignees

• Ebara Corp

Inventors

• Shamoto Mitsuhiro
• Shimoyama Masashi

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/043

  for electroplating · CPC title

• H10W20/033

  in openings in dielectrics · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• H01L21/2885

  Electricity · mapped topic