Plating bath composition and method for electroless plating of palladium

Patent metadata

Field	Value
Publication number	US-2018340261-A1
Application number	US-201615778247-A
Country	US
Kind code	A1
Filing date	Nov 28, 2016
Priority date	Nov 27, 2015
Publication date	Nov 29, 2018
Grant date	—

Abstract

The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and a cyanide group containing aromatic compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the cyanide group containing aromatic compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The cyanide group containing aromatic compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.

First claim

1 . An aqueous plating bath composition for electroless deposition of palladium, comprising
(i) at least one source for palladium ions, (ii) at least one reducing agent for palladium ions, and (iii) at least one cyanide group containing aromatic compound selected from compounds according to Formula (I), salts thereof, and mixtures of the aforementioned; and/or at least one cyanide group containing aromatic compound selected from compounds according to Formula (II), salts thereof, and mixtures of the aforementioned;

wherein R1, R2, R3, R4, R5, R6 are selected independently of each other from the group consisting of R7, —H, C1 to C6 alkyl group, C1 to C6 alkoxy group, amino, aldehyde, mercapto, sulfide group, halogen, allyl, vinyl, ethynyl, propynyl, 1-butynyl, 2-butynyl, 2-ethynylbenzene, phenyl, pyridyl, and naphthyl groups; wherein at least one of R1 to R6 is R7;
wherein R7 is a moiety according to Formula (III),

wherein each R8 is selected independently from the group consisting of —H, C1 to C6 alkyl group, hydroxyl, C1 to C6 alkoxy group, amino, mercapto, and sulfide group;
wherein n is an integer ranging from 0 to 4; and
wherein X is selected from N and C—R13;
wherein Y is selected from N and C—R14; wherein at least one of X or Y is N;
wherein R9, R10, R11, R12, R13, R14 are selected independently of each other from the group consisting of R15, —H, C1 to C6 alkyl group, hydroxyl, C1 to C6 alkoxy group, amino, aldehyde, carboxyl, ester, sulfonic acid, mercapto, sulfide group, halogen, allyl, vinyl, ethynyl, propynyl, 1-butynyl, 2-butynyl, 2-ethynylbenzene, phenyl, pyridyl, and naphthyl groups; wherein at least one of R9 to R14 is R15;
wherein R15 is a moiety according to Formula (IV),

wherein each R16 is selected independently from the group consisting of —H, C1 to C6 alkyl group, hydroxyl, C1 to C6 alkoxy group, amino, mercapto, and sulfide group;
wherein m is an integer ranging from 0 to 4, and wherein if at least one of X or Y is N, R15 is in the ortho or meta position in relation to N within the aromatic ring according to Formula (II).

2 . The aqueous plating bath composition according to claim 1 wherein n is 0.

3 . The aqueous plating bath composition according to claim 1 wherein at least one of R1 to R6 is halogen.

4 . The aqueous plating bath composition according to claim 1 wherein at least one of R1 to R6 is halogen and at least one of R1 to R6 is amino.

5 . (canceled)

6 . The aqueous plating bath composition according to claim 1 wherein X is not N if Y is N; or Y is not N if X is N.

7 . The aqueous plating bath composition according to claim 1 wherein m is an integer selected from 0 or 1.

8 . The aqueous plating bath composition according to claim 1 wherein when X is not N if Y is N, or when Y is not N if X is N, R15 is in meta position in relation to N within an aromatic ring according to Formula (II).

9 . The aqueous plating bath composition according to claim 1 wherein the at least one cyanide group containing aromatic compound according to Formula (I) is selected from the group comprising 3-chlorobenzonitrile, 4-amino-2-chlorobenzonitrile, 2-hydroxy-2-(pyridine-3-yl)acetonitrile, 2-amino-2-(pyridine-3-yl)acetonitrile, picolinonitrile, nicotinonitrile, isonicotinonitrile, pyridine-3,5-dicarbonitrile, 2-aminopyridine-3,5-dicarbonitrile, and pyrimidine-2-carbonitrile.

10 . The aqueous plating bath composition according to claim 1 , wherein the at least one cyanide group containing aromatic compound according to Formula (I) has a concentration ranging from 0.01 to 100 mg/l.

11 . The aqueous plating bath composition according to claim 1 , wherein the pH-value ranges from 4 to 7.

12 . The aqueous plating bath composition according to claim 1 , further comprising at least one complexing agent for palladium ions selected from the group consisting of primary amines, secondary amines and tertiary amines.

13 . The aqueous plating bath composition according to claim 12 , wherein the mole ratio of the complexing agent for palladium ions and palladium ions in the aqueous plating bath composition ranges from 0.5:1 to 50:1.

14 . The aqueous plating bath composition according to claim 1 , wherein the at least one reducing agent for palladium ions is selected from the group comprising hypophosphorous acid, amine boranes, borohydrides, hydrazine, formaldehyde, formic acid, derivatives of the aforementioned and salts thereof.

15 . The aqueous plating bath composition according to claim 1 , wherein the concentration of the at least one reducing agent ranges from 10 to 1000 mmol/l.

16 . A method for electroless palladium plating comprising the steps of
a) providing a substrate, b) contacting the substrate with the aqueous plating bath composition according to claim 1 and thereby depositing a layer of palladium onto at least a portion of the substrate.

17 . The method for electroless palladium plating according to claim 16 wherein the substrate is contacted with the aqueous plating bath composition at a temperature of 30 to 65° C. in step b).

18 . A method for adjusting the deposition rate of any aqueous electroless palladium deposition bath, the method comprises the steps of
c) providing any aqueous electroless palladium deposition bath, and d) adding at least one cyanide group containing aromatic compound according to Formula (I) and/or Formula (II) as defined in claim 1 to the electroless palladium deposition bath, e) and thereby decreasing the deposition rate of the aqueous electroless palladium deposition bath.

19 . The method for adjusting the deposition rate according to claim 18 further comprising one or more of steps
c.i) determining the deposition rate and/or the concentration of the at least one cyanide group containing aromatic compound according to Formula (I) and/or Formula (II) within the aqueous electroless palladium deposition bath according to step c);
c.ii) comparing the value for deposition rate and/or concentration of the at least one cyanide group containing aromatic compound according to Formula (I) and/or Formula (II) determined according to step c.i) with pre-set corresponding threshold values;
c.iii) determining the deviation of the value for deposition rate and/or concentration of the at least one cyanide group containing aromatic compound according to Formula (I) and/or Formula (II) from their corresponding threshold values;
c.iv) correlating the deviation determined according to step c.iii) to an amount of the at least one cyanide group containing aromatic compound according to Formula (I) and/or Formula (II) to be added to the aqueous electroless palladium deposition bath in step d).

20 . (canceled)

21 . The aqueous plating bath composition according to claim 6 wherein m is an integer selected from 0 or 1.

22 . The aqueous plating bath composition according to claim 6 wherein when X is not N if Y is N, or when Y is not N if X is N, R15 is in meta position in relation to N within an aromatic ring according to Formula (II).

23 . The aqueous plating bath composition according to claim 2 w

Assignees

• Atotech Deutschland Gmbh

Inventors

• Walter Andreas
• Suchentrunk Christof
• Beck Thomas
• Steinberger Gerhard
• Bera Holger
• Brunner Heiko
• Rückbrod Sven

Classifications

• H10P14/46

  using a liquid · CPC title

• H10W20/4432

  the principal metal being a noble metal, e.g. gold · CPC title

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• H05K3/243

  characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182) · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title