A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
Electroless copper plating compositions
US9869026B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9869026-B2 |
| Application number | US-201414332326-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 15, 2014 |
| Priority date | Jul 15, 2014 |
| Publication date | Jan 16, 2018 |
| Grant date | Jan 16, 2018 |
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Abstract
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Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
First claim
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What is claimed is: 1. An electroless copper plating composition comprising one or more sources of copper ions, one or more chelating agents chosen from Rochelle salts or dipotassium tartrate, and one or more reducing agents selected from the group consisting of 2,2-dimethoxyacetaldehyde, 2,2-diethoxyacetaldehyde, 2,2dipropoxyacetaldehyde and 2,2-dibutoxyacetaldehyde in amounts of 1 g/L to 50 g/L[, wherein the composition is free of amines]. 2. The composition of claim 1 , wherein the compound is chosen from 2,2-dimethoxyacetaldehyde. 3. The composition of claim 1 , further comprising surfactants, stabilizers, surface modifiers, alkaline compounds, antioxidants or mixtures thereof. 4. The composition of claim 1 , wherein the one or more compounds are in amounts of 5 g/L to 30 g/L.
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Classifications
Contact plating, i.e. electroless electrochemical plating · CPC title
Process of electroless plating · CPC title
by electroless plating (adhesives therefor H05K3/387) · CPC title
characterised by electroless plating method; pretreatment therefor · CPC title
Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement · CPC title
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- What does patent US9869026B2 cover?
- Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
- Who is the assignee on this patent?
- Rohm & Haas Elect Mat, Dow Global Technologies Llc
- What technology area does this patent fall under?
- Primary CPC classification C23C18/40. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).