Tin or tin alloy plating liquid

Patent metadata

Field	Value
Publication number	US-9926637-B2
Application number	US-201514972349-A
Country	US
Kind code	B2
Filing date	Dec 17, 2015
Priority date	Dec 27, 2012
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

Tin or tin alloy plating liquid with a sufficient plated deposit can be formed in the opening without causing burns on the plated film surface or abnormal deposits, and which has a good via filling effect. When a specific α, β-unsaturated carbonyl compound is added into the tin or tin alloy plating liquid, the plating liquid with good via filling performance can be obtained, and the deposit which is substantially free of voids and burns or abnormal deposits on the deposit surface are reduced.

First claim

What is claimed is:

1. A method of electroplating comprising:
a) providing a substrate comprising vias having diameters of 10-100 pm and depths of 10-100 pm;
b) immersing the substrate comprising vias having diameters of 10-100 pm and depths of 10-100 pm in an electroplating liquid comprising a source of tin ions and at least one α, β-unsaturated carbonyl compound selected from the group consisting of citral, 4-hexene-3-one, β-ionone, and 1-acetyl-1-cyclohexene, wherein the at least α, β-unsaturated carbonyl compound is in amounts of 0.01-0.5 g/L; and
c) plating tin in the vias with the electroplating liquid.

2. The method of claim 1 , further comprising an alloying metal ion source.

3. The method of claim 2 , wherein alloying metals are chosen from silver, copper, gold, platinum, zinc, nickel, bismuth, indium, thallium, antimony, palladium, rhodium, iridium and lead.

4. The method of claim 1 , wherein the electroplating liquid further comprises additives chosen from an antioxidant, a complexing agent, a pH adjusting agent, a brightener and a grain refiner.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Okada Hiroki
• Li Shenghua
• Kondo Makoto

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• C23C18/1653

  Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title