Method for recovering metal from waste printed circuit board and a cell thereof
US-12448695-B2 · Oct 21, 2025 · US
characterised by the organic bath constituents used
characterised by the organic bath constituents used · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D3/52 |
| Official title | characterised by the organic bath constituents used |
| Display label | characterised by the organic bath constituents used |
| Total patents | 28 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 4 |
| 2017 | 5 |
| 2019 | 2 |
| 2020 | 3 |
| 2021 | 2 |
| 2022 | 3 |
| 2023 | 2 |
| 2025 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electroplating solutions
US-12442099-B2 · Oct 14, 2025 · US
Electroplating solutions
US-2025305175-A1 · Oct 2, 2025 · US
Leveling agent, composition, and application thereof
US-2025215598-A1 · Jul 3, 2025 · US
Method for recovering metal from waste printed circuit board and a cell thereof
US-2023416936-A1 · Dec 28, 2023 · US
Electroplating solutions
US-2023407507-A1 · Dec 21, 2023 · US
Metal or metal alloy deposition composition and plating compound
US-11512405-B2 · Nov 29, 2022 · US
Coating surfaces with nanostructures
US-11414761-B2 · Aug 16, 2022 · US
Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods
US-2022112619-A1 · Apr 14, 2022 · US
Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods
US-2021172082-A1 · Jun 10, 2021 · US
Plating film
US-2021087702-A1 · Mar 25, 2021 · US
Physiological characteristic sensors and methods for forming such sensors
US-10845330-B2 · Nov 24, 2020 · US
Metal or metal alloy deposition composition and plating compound
US-2020340132-A1 · Oct 29, 2020 · US
Electrolyte, method of forming a copper layer and method of forming a chip
US-10648096-B2 · May 12, 2020 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
US-10508349-B2 · Dec 17, 2019 · US
Thermal barrier-coated Ni alloy component and manufacturing method thereof
US-10358700-B2 · Jul 23, 2019 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
US-2017370014-A1 · Dec 28, 2017 · US
Method of fabricating a bath of electrolyte for plating a platinum-based metallic underlayer on a metallic substrate
US-9752243-B2 · Sep 5, 2017 · US
Physiological characteristic sensors and methods for forming such sensors
US-2017248542-A1 · Aug 31, 2017 · US
Physiological characteristic sensors and methods for forming such sensors
US-9681828-B2 · Jun 20, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D3/52?
- CPC C25D3/52 is the Cooperative Patent Classification code for “characterised by the organic bath constituents used.”
- How many patents are filed under CPC C25D3/52 (characterised by the organic bath constituents used)?
- Our database includes 28 publications tagged with this CPC code.
- Is patent activity under CPC C25D3/52 growing?
- Publication counts under this code: 2 in 2023 vs 4 in 2025 (latest complete years).