Method of fabricating a bath of electrolyte for plating a platinum-based metallic underlayer on a metallic substrate

US9752243B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9752243-B2
Application numberUS-201314395190-A
CountryUS
Kind codeB2
Filing dateApr 18, 2013
Priority dateApr 19, 2012
Publication dateSep 5, 2017
Grant dateSep 5, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The invention relates to a method of fabricating a bath of electrolyte for plating a platinum-based metal underlayer on a metallic substrate, comprising: a) providing a first system having ligands and amine functional groups, the first system being constituted by an aqueous solution of an amino ligand comprising at least one compound X—(NH 2 ) n , where X belongs to the group constituted by (CH 3 , CH 3 —CH 2 , CH 3 —(CH 2 ) m ), or NH 3 or an xP − (NH 4 ) + p salt where x is an acid radical belonging to the group constituted by (PO 4 3− , HPO 4 2− , H 2 PO 4 − , HPO 4 2− and H 2 PO 4 − , SO 4 2− , HSO 4 − , H 2 SO 4 , HSO 4 − , and H 2 SO 4 , CH 3 COO − , CH 3 COOH, and CH 3 COO − ), or H 2 SO 4 , or CH 3 COOH, and where n, m, and p are non-zero integers; b) providing a second system forming a buffer system; c) providing a third system providing a metallic salt, and constituted by an aqueous solution of platinum; d) providing a fourth system suitable for imparting the conduction property to the medium; and e) mixing together the four systems so as to obtain the electrolyte bath.

First claim

Opening claim text (preview).

The invention claimed is: 1. A fabrication method for a bath of electrolyte, the method comprising: a) providing a first system having ligands and amine functional groups, said first system comprising an aqueous solution of an amino ligand comprising: (i) at least one compound X—(NH 2 ) n , where X is selected from the group consisting of (CH 3 , CH 3 —CH 2 , CH 3 —(CH 2 ) m ; (ii) NH 3 ; or (iii) an x P− (NH 4 ) + p salt where x is an acid radical selected from the group consisting of PO 4 3− , HPO 4 2− , H 2 PO 4 − , SO 4 2− , HSO 4 − , and CH 3 COO−, where n, m, and p are non-zero integers; b) providing a second system forming a buffer system; c) providing a third system providing a metallic salt, and comprising an aqueous solution of platinum; the metallic salt being at least one salt of platinum of degree of oxidation IV; d) providing a fourth system suitable for imparting the property of conduction to the bath of electrolyte; forming a first solution B by grouping the first system, the second system, and the fourth system together in a single solution; forming a second solution A comprising sodium hydroxide and the least one salt of platinum of degree of oxidation IV of the third system; and e) mixing together the four systems so as to obtain the electrolyte bath of electrolyte; wherein the mixing comprises: e1) covering the first solution B and raising the first solution B to a temperature of at least 50° C. for at least 1h30 and e2) adding the second solution A to the first solution B and mixing the second solution A with the first solution B thereby forming a platinum amino complex and thus obtaining said bath of electrolyte. 2. The method according to claim 1 , the first solution B comprises the x p− (NH 4 ) + p salt, where x=HPO 4 2− and p=2, and/or x=H 2 PO 4 − and p=1. 3. The method according to claim 2 , further comprising f) heating the bath of electrolyte to a temperature of 80° C. to 97° C. for at least two hours; and g) electroplating a deposit of platinum on a metallic substrate using said heated bath of electrolyte. 4. The method according to claim 3 , wherein prior to e2), the first solution B is raised to a temperature of 60° C. 5. The method according to claim 3 , wherein the molar ratio of sodium hydroxide (NaOH) to the salt of platinum of degree of oxidation IV is 2. 6. The method according to claim 1 , wherein said salt of platinum of degree of oxidation IV is Y 2 PtM 6 with Y═NH 4 + , H + , or K + , and M=Cl − or OH − . 7. The method according to claim 6 , wherein in the second solution A, said salt of platinum of degree of oxidation IV is diammonium hexachloroplatinate of formula (NH 4 ) 2 PtCl 6 . 8. The method according to claim 1 , wherein x of the x p− (NH 4 ) + p salt is an acid radical selected from the group consisting of HPO 4 2− and H 2 PO 4 − ; and wherein the first system comprises diammonium hydrogen phosphate (NH 4 ) 2 HPO 4 , ammonium dihydrogen phosphate NH 4 H 2 PO 4 , or a mixture thereof. 9. The method according to claim 8 , wherein a molar ratio between the ammonium dihydrogen phosphate NH 4 H 2 PO 4 and the diammonium hydrogen phosphate (NH 4 ) 2 HPO 4 is 2. 10. The method according to claim 1 , wherein said second solution A is heated before step e2).

Assignees

Inventors

Classifications

  • C25D3/52Primary

    characterised by the organic bath constituents used · CPC title

  • Pretreatment of metallic surfaces to be electroplated · CPC title

  • C25D3/50Primary

    of platinum group metals · CPC title

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What does patent US9752243B2 cover?
The invention relates to a method of fabricating a bath of electrolyte for plating a platinum-based metal underlayer on a metallic substrate, comprising: a) providing a first system having ligands and amine functional groups, the first system being constituted by an aqueous solution of an amino ligand comprising at least one compound X—(NH 2 ) n , where X belongs to the group constitut…
Who is the assignee on this patent?
Snecma
What technology area does this patent fall under?
Primary CPC classification C25D3/52. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 05 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).