Plating film

Patent metadata

Field	Value
Publication number	US-2021087702-A1
Application number	US-201916968351-A
Country	US
Kind code	A1
Filing date	Jan 28, 2019
Priority date	Feb 8, 2018
Publication date	Mar 25, 2021
Grant date	—

Abstract

Provided is a plating film that can exhibit a high gloss and a low contact resistance value. The plating film according to an embodiment of the present invention is a plating film including a noble metal matrix and nanodiamond particles dispersed in the noble metal matrix. The plating film according to an embodiment of the present invention preferably has a gloss at an incident angle of 60° of not less than 250 GU and/or a contact resistance value at a load of 50 gf of not greater than 1 mΩ, and a difference between a contact resistance value at a load of 50 gf and a contact resistance value at a load of 5 gf of not greater than 5 mΩ. The nanodiamond particles are preferably nanodiamond particles including a surface-modifying group containing a sterically repulsive group and particularly preferably nanodiamond particles including a surface-modifying group containing a polyglycerol chain.

First claim

1 . A plating film comprising a noble metal matrix and nanodiamond particles dispersed in the noble metal matrix.

2 . The plating film according to claim 1 , wherein the plating film has a gloss at an incident angle of 60° of not less than 250 GU.

3 . The plating film according to claim 1 , wherein the plating film is produced using a plating bath comprising noble metal ions and nanodiamond particles.

4 . The plating film according to claim 3 , wherein the plating film has a gloss at an incident angle of 60° by not less than 20 GU compared with a plating film produced using a plating bath having an identical composition except for not containing nanodiamond particles.

5 . The plating film according to claim 1 , wherein the plating film has a contact resistance value at a load of 50 gf of not greater than 1 mΩ, and a difference between a contact resistance value at a load of 50 gf and a contact resistance value at a load of 5 gf of not greater than 5 mΩ.

6 . The plating film according to claim 1 , wherein the plating film has a surface roughness (Ra) of not greater than 0.5 μm.

7 . The plating film according to claim 1 , wherein a particle diameter (D50) of the nanodiamond particles dispersed in the noble metal matrix by scanning electron microscopy is in a range from 4 to 100 nm.

8 . The plating film according to claim 1 , wherein the nanodiamond particles comprise a surface-modifying group containing a sterically repulsive group.

9 . The plating film according to claim 1 , wherein the nanodiamond particles comprise a surface-modifying group containing a polyglycerol chain.

10 . The plating film according to claim 1 , wherein a content of the nanodiamond particles is from 0.5 to 25 area % of the plating film.

11 . A plating film producing method for producing the plating film described in claim 1 by electrolytic plating using a plating bath comprising noble metal ions and nanodiamond particles, the plating bath containing from 0.001 to 1.0 g/L of the nanodiamond particles and having a light transmittance of light at a wavelength of 600 nm of not less than 95%.

12 . A plating bath comprising noble metal ions and nanodiamond particles, the plating bath containing from 0.005 to 1.0 g/L of the nanodiamond particles and having a light transmittance of light at a wavelength of 600 nm of not less than 95%.

13 . An electronic component comprising the plating film described in claim 1 .

14 . A leveling agent comprising nanodiamond particles comprising a surface-modifying group containing a polyglycerol chain.

15 . The plating film according to claim 1 , wherein the nanodiamond particles comprise a surface-modifying group containing a sterically repulsive group derived from a hydrophilic polymer.

16 . The plating film according to claim 1 , wherein the nanodiamond particles comprise from 0.4 to 1.0 parts by mass of a surface-modifying group per part by mass of the nanodiamond particles.

17 . The plating film according to claim 1 , wherein the nanodiamond particles comprising a surface-modifying group containing a polyglycerol chain are nanodiamond particles comprising a surface-modifying group containing a polyglycerol chain obtained by ring-opening polymerization from 20 to 150 parts by mass of glycidol relative to 1 part by mass of the nanodiamond particles.

18 . The plating bath according to claim 12 , wherein the nanodiamond particles comprise a surface-modifying group containing a sterically repulsive group derived from a hydrophilic polymer.

19 . The plating bath according to claim 12 , wherein the nanodiamond particles comprising a surface-modifying group containing a polyglycerol chain.

20 . The plating bath according to claim 12 , comprising no surfactant or comprising not greater than 0.05 g/L of a surfactant.

Assignees

• Daicel Corp

Inventors

• Kimoto Norihiro
• Goto Tomohiro
• Umemoto Kouichi

Classifications

• Y10T428/12903

  Cu-base component · CPC title

• Y10T428/12889

  Au-base component · CPC title

• Y10T428/12868

  Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.] · CPC title

• Y10T428/12625

  Free carbon containing component · CPC title

• C23C30/00

  Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process (C23C26/00, C23C28/00 take precedence) · CPC title