Physiological characteristic sensors and methods for forming such sensors

Patent metadata

Field	Value
Publication number	US-10845330-B2
Application number	US-201715595687-A
Country	US
Kind code	B2
Filing date	May 15, 2017
Priority date	May 1, 2014
Publication date	Nov 24, 2020
Grant date	Nov 24, 2020

Abstract

A physiological characteristic sensor, a method for forming a physiological characteristic sensor, and a method for forming a platinum deposit having a rough surface are presented here. The method for forming a physiological characteristic sensor includes immersing a sensor electrode in a platinum electrolytic bath. Further, the method includes performing an electrodeposition process by sequentially applying a pulsed signal to the sensor electrode, wherein the pulsed signal includes a repeated cycle of a first current and a second current different from the first current, and applying a non-pulsed continuous signal to the sensor electrode, wherein the non-pulsed continuous signal includes a non-repeated application of a third current, to form a platinum deposit on the sensor electrode.

First claim

What is claimed is:

1. A method for forming a physiological characteristic sensor, the method comprising the steps of:
immersing a sensor electrode in a platinum electrolytic bath; and
performing an electrodeposition process by sequentially applying a pulsed signal to the sensor electrode, wherein the pulsed signal includes a repeated cycle of a first current and a second current different from the first current, wherein the first current and the second current have a same polarity, and applying a non-pulsed continuous signal to the sensor electrode, wherein the non-pulsed continuous signal includes a non-repeated application of a third current, to form a platinum deposit on the sensor electrode.

2. The method of claim 1 wherein performing the electrodeposition process comprises applying the pulsed signal to the sensor electrode before applying the non-pulsed continuous signal to the sensor electrode.

3. The method of claim 1 wherein performing the electrodeposition process comprises applying the pulsed signal to the sensor electrode after applying the non-pulsed continuous signal to the sensor electrode.

4. The method of claim 1 wherein applying the pulsed signal to the sensor electrode comprises applying the repeated cycle of the first current of between about −50 μA and about −150 μA and the second current of less than 0 μA and about −20 μA.

5. The method of claim 1 wherein applying the pulsed signal to the sensor electrode comprises applying from about 100 to about 300 cycles of the first current and the second current to the sensor electrode.

6. The method of claim 1 wherein applying the pulsed signal to the sensor electrode comprises applying cycles of about 0.1 seconds to about 4 seconds of the first current and about 0.1 seconds to about 4 seconds of the second current to the sensor electrode.

7. The method of claim 1 wherein applying the pulsed signal to the sensor electrode comprises applying a pulsed current in a square pulse pattern.

8. The method of claim 1 , wherein immersing the sensor electrode in a platinum electrolytic bath comprises immersing the sensor electrode in a solution of hydrogen hexachloroplatinate (H 2 PtCl 6 ) and lead acetate trihydrate (Pb(CH 3 COO) 2 .3H 2 O).

9. The method of claim 1 wherein applying the pulsed signal to the sensor electrode comprises applying a first pulsed signal to the sensor electrode in a first sequence and applying a second pulsed signal to the sensor electrode in a second sequence.

10. The method of claim 1 wherein applying the pulsed signal to the sensor electrode comprises applying a first pulsed signal to the sensor electrode in a first sequence and applying a second pulsed signal to the sensor electrode in a second sequence and wherein applying the non-pulsed continuous signal to the sensor electrode comprises applying a first non-pulsed continuous signal to the sensor electrode and applying a second non-pulsed continuous signal to the sensor electrode.

11. The method of claim 1 , wherein the electrodeposition process forms the sensor electrode with an electrochemical real surface area at least about 80 times greater than a cross sectional area of the sensor electrode.

12. The method of claim 11 , wherein the sensor electrode is formed with a platinum coating having the cross sectional area and the electrochemical real surface area, wherein the platinum coating includes a substantially continuous base portion having a thickness of from about 0.5 to about 1.5 μm and a discontinuous upper portion having thickness of from about 0.6 to about 2.5 μm.

13. A method for forming a platinum deposit having a rough surface, the method comprising the steps of:
contacting a deposition site with a platinum electrolyte; and
performing a hybrid pulse/continuous electrodeposition process by sequentially applying a pulsed signal to the deposition site, wherein the pulsed signal includes a repeated cycle of a first current and a second current different from the first current, wherein the first current and the second current have a same polarity, and applying a non-pulsed continuous signal to the deposition site, wherein the non-pulsed continuous signal includes a non-repeated application of a third current, to form the platinum deposit on the deposition site.

14. The method of claim 13 wherein applying the pulsed signal to the deposition site comprises applying cycles of about 0.1 seconds to about 4 seconds of the first current and about 0.1 seconds to about 4 seconds of the second current to the deposition site, and wherein applying the non-pulsed continuous signal to the deposition site comprises applying the third current to the deposition site for from about 50 seconds to about 240 seconds.

15. The method of claim 13 wherein performing the hybrid pulse/continuous electrodeposition process further comprises applying a second pulsed signal to the deposition site, wherein the second pulsed signal includes a repeated cycle of a fourth current and a fifth current different from the fourth current.

16. The method of claim 13 , wherein the hybrid pulse/continuous electrodeposition process forms the platinum deposit with an electrochemical real surface area at least about 80 times greater than a cross sectional area of the platinum deposit.

17. The method of claim 16 , wherein the hybrid pulse/continuous electrodeposition process forms the platinum deposit with a substantially continuous base portion having a thickness of from about 0.5 to about 1.5 μm and a discontinuous upper portion having thickness of from about 0.6 to about 2.5 μm.

18. The method of claim 1 wherein the first current and the second current each have a negative polarity.

19. The method of claim 13 wherein the first current and the second current each have a negative polarity.

20. The method of claim 19 wherein applying the pulsed signal to the deposition site comprises applying the repeated cycle of the first current of between about −50 μA and about −150 μA and the second current of less than 0 μA and about −20 μA.

Assignees

• Medtronic Minimed Inc

Inventors

• Jacks Steven C
• Gautham Raghavendhar
• Liang Bradley C
• Little Megan E
• Pesantez Daniel E
• Shah Rajiv

Classifications

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• G01N27/416 Primary

  Systems (G01N27/27 takes precedence) · CPC title

• C25D5/605 Primary

  Surface topography of the layers, e.g. rough, dendritic or nodular layers · CPC title

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title

• A61B5/14532

  for measuring glucose, e.g. by tissue impedance measurement · CPC title